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Paper Abstract and Keywords
Presentation 2010-09-10 11:35
Study on the structure of the bottom conductor layer for CBCPW on the low-resistivity silicon substrate
Wataru Tomiyama, Takashi Shimizu, Yoshinori Kogami (Utsunomiya Univ.) MW2010-81
Abstract (in Japanese) (See Japanese page) 
(in English) Recently, the realization of the millimeter wave applications has been promoting the development of the mm-wave Si CMOS circuits. There are concerns about the increase in transmission losses due to ohmic losses when low-resistivity silicon substrate is used. Therefore, one of the important issues is the reduction of the transmission losses. In this paper, it is studied that the effect on the transmission characteristic by the bottom conductor (1st metal layer) structure for the conductor backed coplanar waveguide, which composed by the insulator layer on the low-resistivity silicon substrate, using 3D electromagnetic field simulator. As a result, it is found that the transmission characteristic is greatly changed by the conductor arrangement of the 1st metal layer
Keyword (in Japanese) (See Japanese page) 
(in English) Conductor backed coplanar waveguide / Metal layer / Low-resistivity silicon / millimeter wave / / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 197, MW2010-81, pp. 81-84, Sept. 2010.
Paper # MW2010-81 
Date of Issue 2010-09-02 (MW) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee MW  
Conference Date 2010-09-09 - 2010-09-10 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Inst. of Tech. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To MW 
Conference Code 2010-09-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study on the structure of the bottom conductor layer for CBCPW on the low-resistivity silicon substrate 
Sub Title (in English)  
Keyword(1) Conductor backed coplanar waveguide  
Keyword(2) Metal layer  
Keyword(3) Low-resistivity silicon  
Keyword(4) millimeter wave  
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1st Author's Name Wataru Tomiyama  
1st Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
2nd Author's Name Takashi Shimizu  
2nd Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
3rd Author's Name Yoshinori Kogami  
3rd Author's Affiliation Utsunomiya University (Utsunomiya Univ.)
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Speaker Author-1 
Date Time 2010-09-10 11:35:00 
Presentation Time 20 minutes 
Registration for MW 
Paper # MW2010-81 
Volume (vol) vol.110 
Number (no) no.197 
Page pp.81-84 
#Pages 4 
Date of Issue 2010-09-02 (MW) 

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