Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-09-29 14:50
Evaluation of Fictive Temperature of Synthetic Silica Glasses by the Ultrasonic Microspectroscopy Technology
Jun-ichi Kushibiki, Mototaka Arakawa, Yuji Ohashi, Yuko Maruyama, Takanori Kondo, Tetsuo Yoshida (Tohoku Univ.) US2010-52
Abstract (in Japanese) (See Japanese page) 
(in English) We developed an evaluation method of fictive temperatures TF for synthetic silica (SiO2) glasses by the ultrasonic micro-spectroscopy technology. Specimens prepared from two kinds of commercial SiO2 glasses with different OH concentrations were heat-treated at desired annealing temperatures from 900 to 1200°C. Longitudinal and shear velocities (Vl and Vs), leaky surface acoustic wave (LSAW) velocities (VLSAW), and densities (ρ) were measured. Vl varied most significantly among the acoustic properties. TF dependences of acoustic properties were obtained from relationships between Vl and ρ, which was reported that it is in a linear relationship with TF. Different TF dependences were detected for the two types of SiO2 glasses because of different OH concentrations. The resolutions were 0.3-0.4°C, and they were 40-150 times higher than the conventional methods using Raman spectroscopy and infrared spectroscopy. VLSAW measurements can provide two-dimensional TF distributions on the specimen surface with resolutions of about 10°C. This ultrasonic method is extremely useful for TF evaluation for SiO2 glasses.
Keyword (in Japanese) (See Japanese page) 
(in English) ultrasonic micro-spectroscopy technology / synthetic silica glass / fictive temperature / longitudinal velocity / shear velocity / leaky surface acoustic wave velocity / density /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 213, US2010-52, pp. 23-28, Sept. 2010.
Paper # US2010-52 
Date of Issue 2010-09-22 (US) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2010-52

Conference Information
Committee US  
Conference Date 2010-09-29 - 2010-09-30 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) General 
Paper Information
Registration To US 
Conference Code 2010-09-US 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Evaluation of Fictive Temperature of Synthetic Silica Glasses by the Ultrasonic Microspectroscopy Technology 
Sub Title (in English)  
Keyword(1) ultrasonic micro-spectroscopy technology  
Keyword(2) synthetic silica glass  
Keyword(3) fictive temperature  
Keyword(4) longitudinal velocity  
Keyword(5) shear velocity  
Keyword(6) leaky surface acoustic wave velocity  
Keyword(7) density  
Keyword(8)  
1st Author's Name Jun-ichi Kushibiki  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Mototaka Arakawa  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Yuji Ohashi  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Yuko Maruyama  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Takanori Kondo  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Tetsuo Yoshida  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-2 
Date Time 2010-09-29 14:50:00 
Presentation Time 25 minutes 
Registration for US 
Paper # US2010-52 
Volume (vol) vol.110 
Number (no) no.213 
Page pp.23-28 
#Pages 6 
Date of Issue 2010-09-22 (US) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan