Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2010-11-11 10:45
The effect of mechanical parameters of switch-type contact on relay life
Wanbin Ren, Yubin Jiao, Xiaochen Li, Qiong Yu (Harbin Inst. of Tech.) EMD2010-75
Abstract (in Japanese) (See Japanese page) 
(in English) The mechanical parameters of relay mainly include over-travel of N.O. contacts and N.C. contacts, contact gap, and magnetic gap. The test was done by a model relay testing device, which could set the mechanical parameters assembly. Arc duration time, bouncing time, release time, contact resistance etc were recorded explicitly during relay life test in order to analysis the effect of mechanical parameters on contact switching characteristics. Results showed that the mechanical parameters had a great influence on degradation of relay switching characteristics and life. The conclusions which draw in this paper are meaningful for optimization mechanical parameters of switch-type contact in relay.
Keyword (in Japanese) (See Japanese page) 
(in English) relay / mechanical parameters / time parameters / life test / switch-type / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 270, EMD2010-75, pp. 37-40, Nov. 2010.
Paper # EMD2010-75 
Date of Issue 2010-11-04 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2010-75

Conference Information
Committee EMD  
Conference Date 2010-11-11 - 2010-11-12 
Place (in Japanese) (See Japanese page) 
Place (in English) Xi'an Jiaotong University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) IS-EMD2010 (10th International Session in Electro-Mechanical Devices) 
Paper Information
Registration To EMD 
Conference Code 2010-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The effect of mechanical parameters of switch-type contact on relay life 
Sub Title (in English)  
Keyword(1) relay  
Keyword(2) mechanical parameters  
Keyword(3) time parameters  
Keyword(4) life test  
Keyword(5) switch-type  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Wanbin Ren  
1st Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
2nd Author's Name Yubin Jiao  
2nd Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
3rd Author's Name Xiaochen Li  
3rd Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
4th Author's Name Qiong Yu  
4th Author's Affiliation Harbin Institute of Technology (Harbin Inst. of Tech.)
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2010-11-11 10:45:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2010-75 
Volume (vol) vol.110 
Number (no) no.270 
Page pp.37-40 
#Pages 4 
Date of Issue 2010-11-04 (EMD) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan