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Paper Abstract and Keywords
Presentation 2010-11-19 14:50
The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives
Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON) R2010-34
Abstract (in Japanese) (See Japanese page) 
(in English) Relays are used for various purposes, and are demanded for high operating reliability in a variety of environments. Sealing relays, which is a kind of relays, are sealed using sealant for preventing from invading foreign substances, corrosive gases, and soldering flux. But, in recent years, lead-free soldering makes difficult seal relays because lead-free soldering has higher melting point than lead soldering. Sealing relays have the two types which are the surface mount type and the trough-hole type. The surface mount type is more difficult than the trough-hole type to maintain airtight because the surface mount type is heated to higher temperature than the trough-hole type when they are mounted on printed circuit board. We revealed that the heat resistant airtight property of the surface mounted relay was weakened in direct proportion to humidity inside the relay. And we report the method to reduce the permeability in sealing adhesives.
Keyword (in Japanese) (See Japanese page) 
(in English) Relay / Epoxy / permeability / / / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 298, R2010-34, pp. 9-13, Nov. 2010.
Paper # R2010-34 
Date of Issue 2010-11-12 (R) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee R  
Conference Date 2010-11-19 - 2010-11-19 
Place (in Japanese) (See Japanese page) 
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Paper Information
Registration To R 
Conference Code 2010-11-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives 
Sub Title (in English)  
Keyword(1) Relay  
Keyword(2) Epoxy  
Keyword(3) permeability  
1st Author's Name Tomohiro Fukuhara  
1st Author's Affiliation OMRON Corporation (OMRON)
2nd Author's Name Mitsuo Ito  
2nd Author's Affiliation OMRON Corporation (OMRON)
3rd Author's Name Osamu Otani  
3rd Author's Affiliation OMRON Corporation (OMRON)
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Speaker Author-1 
Date Time 2010-11-19 14:50:00 
Presentation Time 25 minutes 
Registration for R 
Paper # R2010-34 
Volume (vol) vol.110 
Number (no) no.298 
Page pp.9-13 
Date of Issue 2010-11-12 (R) 

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