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| Presentation | 2010-11-19 14:50 The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON)  R2010-34 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Relays are used for various purposes, and are demanded for high operating reliability in a variety of environments. Sealing relays, which is a kind of relays, are sealed using sealant for preventing from invading foreign substances, corrosive gases, and soldering flux. But, in recent years, lead-free soldering makes difficult seal relays because lead-free soldering has higher melting point than lead soldering. Sealing relays have the two types which are the surface mount type and the trough-hole type. The surface mount type is more difficult than the trough-hole type to maintain airtight because the surface mount type is heated to higher temperature than the trough-hole type when they are mounted on printed circuit board. We revealed that the heat resistant airtight property of the surface mounted relay was weakened in direct proportion to humidity inside the relay. And we report the method to reduce the permeability in sealing adhesives. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Relay / Epoxy / permeability / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 110, no. 298, R2010-34, pp. 9-13, Nov. 2010. | |
| Paper # | R2010-34 | |
| Date of Issue | 2010-11-12 (R) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | R2010-34 |
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| Conference Information | |
| Committee | R |
| Conference Date | 2010-11-19 - 2010-11-19 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | R |
| Conference Code | 2010-11-R |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives |
| Sub Title (in English) | |
| Keyword(1) | Relay |
| Keyword(2) | Epoxy |
| Keyword(3) | permeability |
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| 1st Author's Name | Tomohiro Fukuhara |
| 1st Author's Affiliation | OMRON Corporation (OMRON) |
| 2nd Author's Name | Mitsuo Ito |
| 2nd Author's Affiliation | OMRON Corporation (OMRON) |
| 3rd Author's Name | Osamu Otani |
| 3rd Author's Affiliation | OMRON Corporation (OMRON) |
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| Speaker | Author-1 |
| Date Time | 2010-11-19 14:50:00 |
| Presentation Time | 25 minutes |
| Registration for | R |
| Paper # | R2010-34 |
| Volume (vol) | vol.110 |
| Number (no) | no.298 |
| Page | pp.9-13 |
| #Pages | 5 |
| Date of Issue | 2010-11-12 (R) |
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