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Paper Abstract and Keywords
Presentation 2011-05-27 09:05
Evaluation of Power/Ground Layers with EBG structure and Ferrite Film for Noise Suppression and Power-Integrity Improvement
Farhan Zaheed Mahmood, Yoshitaka Toyota, Kengo Iokibe (Okayama Univ.), Koichi Kondo, Shigeyoshi Yoshida (NEC TOKIN Co.) EMCJ2011-22 MW2011-19 EST2011-15
Abstract (in Japanese) (See Japanese page) 
(in English) Power/ground layers of Printed Circuit Board (PCB) require two conditions of
noise suppression and power integrity (PI).
We proposed the application of Electromagnetic Bandgap (EBG) structure and ferrite film
to power/ground layers.
In this paper, not only a test board with the proposed structure but
three other test boards to be compared were fabricated to measure with a vector network analyzer.
The measured data was evaluated for EMI and PI characteristics.
Additional evaluation using a commercial circuit simulator was carried out
to evaluate PI characteristics for assuming a real power-supply circuit.
Through the evaluation, the proposed structure provided sufficient results.
Also almost same characteristics was provided by the test board with only ferrite film.
Keyword (in Japanese) (See Japanese page) 
(in English) PCB / EBG structure / Ferrite film / Noise suppression / PI / / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 64, EMCJ2011-22, pp. 75-80, May 2011.
Paper # EMCJ2011-22 
Date of Issue 2011-05-19 (EMCJ, MW, EST) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2011-22 MW2011-19 EST2011-15

Conference Information
Committee EMCJ MW EST  
Conference Date 2011-05-26 - 2011-05-27 
Place (in Japanese) (See Japanese page) 
Place (in English) NICT 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave, EMC, etc. 
Paper Information
Registration To EMCJ 
Conference Code 2011-05-EMCJ-MW-EST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Evaluation of Power/Ground Layers with EBG structure and Ferrite Film for Noise Suppression and Power-Integrity Improvement 
Sub Title (in English)  
Keyword(1) PCB  
Keyword(2) EBG structure  
Keyword(3) Ferrite film  
Keyword(4) Noise suppression  
Keyword(5) PI  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Farhan Zaheed Mahmood  
1st Author's Affiliation Okayama University (Okayama Univ.)
2nd Author's Name Yoshitaka Toyota  
2nd Author's Affiliation Okayama University (Okayama Univ.)
3rd Author's Name Kengo Iokibe  
3rd Author's Affiliation Okayama University (Okayama Univ.)
4th Author's Name Koichi Kondo  
4th Author's Affiliation NEC TOKIN Corporation (NEC TOKIN Co.)
5th Author's Name Shigeyoshi Yoshida  
5th Author's Affiliation NEC TOKIN Corporation (NEC TOKIN Co.)
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Speaker Author-1 
Date Time 2011-05-27 09:05:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2011-22, MW2011-19, EST2011-15 
Volume (vol) vol.111 
Number (no) no.64(EMCJ), no.65(MW), no.66(EST) 
Page pp.75-80 
#Pages 6 
Date of Issue 2011-05-19 (EMCJ, MW, EST) 

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