| Paper Abstract and Keywords |
| Presentation |
2011-10-20 15:20
Effect of Si surface roughness on electrical characteristics of HfON gate insulator Dae-Hee Han, Shun-ichiro Ohmi (Tokyo Inst. of Tech.) SDM2011-100 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
In this paper, the effect of Si surface roughness on electrical characteristics of HfON gate insulator formed by the electron cyclotron resonance (ECR) plasma sputtering was investigated. In order to improve the electrical characteristics of HfON gate insulator, interface roughness between HfON and Si substrate should be reduced. The surface roughness of Si substrate was reduced by 1 μm-thick wet oxidation followed by the wet etching (HCl:HF=19:1). The obtained RMS roughness was 0.11 nm (as-cleaned: 0.21 nm). The HfON was formed by 1 nm-thick HfN deposition utilizing ECR plasma sputtering followed by the Ar/O2 plasma oxidation. The 600°C PDA was carried out for 1 min in N2 ambient. It was found that the leakage current was decreased from 2 x 10-3 A/cm2 to 3 x 10-4 A/cm2 at VFB -1 V by reducing the Si surface roughness. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
Surface roughness / HfON gate insulator / ECR plasma sputtering / / / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 111, no. 249, SDM2011-100, pp. 17-20, Oct. 2011. |
| Paper # |
SDM2011-100 |
| Date of Issue |
2011-10-13 (SDM) |
| ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Download PDF |
SDM2011-100 |
| Conference Information |
| Committee |
SDM |
| Conference Date |
2011-10-20 - 2011-10-21 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
Tohoku Univ. (Niche) |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
Process science and new process technologies |
| Paper Information |
| Registration To |
SDM |
| Conference Code |
2011-10-SDM |
| Language |
English |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Effect of Si surface roughness on electrical characteristics of HfON gate insulator |
| Sub Title (in English) |
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| Keyword(1) |
Surface roughness |
| Keyword(2) |
HfON gate insulator |
| Keyword(3) |
ECR plasma sputtering |
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| 1st Author's Name |
Dae-Hee Han |
| 1st Author's Affiliation |
Tokyo Institute of Technology (Tokyo Inst. of Tech.) |
| 2nd Author's Name |
Shun-ichiro Ohmi |
| 2nd Author's Affiliation |
Tokyo Institute of Technology (Tokyo Inst. of Tech.) |
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| Speaker |
Author-1 |
| Date Time |
2011-10-20 15:20:00 |
| Presentation Time |
25 minutes |
| Registration for |
SDM |
| Paper # |
SDM2011-100 |
| Volume (vol) |
vol.111 |
| Number (no) |
no.249 |
| Page |
pp.17-20 |
| #Pages |
4 |
| Date of Issue |
2011-10-13 (SDM) |