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Paper Abstract and Keywords
Presentation 2011-11-18 09:25
Deformation of Crystal Morphology in Tin Plated Contact Layer caused by Loading
Terutaka Tamai (Elcontech Consulting), Shigeru Sawada (Mie Univ.), Yasuhiro Hattori (AutoNetworks Lab.) EMD2011-90
Abstract (in Japanese) (See Japanese page) 
(in English) Tin (Sn) plated contacts are widely applied to connector contacts in aut
omotive industries. Surfaces of plated tin are covered with their oxide
film. But it is possible to obtain low contact resistance by applying hi
gh contact load. Tendency in down size of connectors will increase in ne
ar future. Therefore, it is important to study contact resistance charac
teristics under low contact load. In this study, mechanical deformation
phenomena of tin crystal morophology of the plated layerin a contact are
a under loading was studyed with respect to contact resistance behavior.
It was found that in the contact configuration for hemisphere of platin
um and tin plated flatcontacts, the hemisphere surfsce indented into the
softer tin plated flat surface. As results, piling up the crystal grain
s of the periphery of the contact trace occurs. During the piling up the
periphery, sudden decrease in contact resistance was found. To clarify
these phenomena, the mechanical stress distribution in the layer wasnume
rically analyzed by FEM. Change in crystal morphorogy was obserbed by ST
M and EBSP. The mechanical stress in the layer propagated to the periphe
ry of the contact area along radial direction during loading. This pheno
mena is very different from usual decrease in contact resistanec due to
elastic and plastc deformation.
Keyword (in Japanese) (See Japanese page) 
(in English) tin plated contact / contact resistance / contact load / contact trace / connector / crystal morophlogy / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 299, EMD2011-90, pp. 127-132, Nov. 2011.
Paper # EMD2011-90 
Date of Issue 2011-11-10 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2011-90

Conference Information
Committee EMD  
Conference Date 2011-11-17 - 2011-11-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Akita Univ. Tegata Campus 
Topics (in Japanese) (See Japanese page) 
Topics (in English) International Session IS-EMD2011 
Paper Information
Registration To EMD 
Conference Code 2011-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Deformation of Crystal Morphology in Tin Plated Contact Layer caused by Loading 
Sub Title (in English)  
Keyword(1) tin plated contact  
Keyword(2) contact resistance  
Keyword(3) contact load  
Keyword(4) contact trace  
Keyword(5) connector  
Keyword(6) crystal morophlogy  
Keyword(7)  
Keyword(8)  
1st Author's Name Terutaka Tamai  
1st Author's Affiliation Elcontech Consulting (Elcontech Consulting)
2nd Author's Name Shigeru Sawada  
2nd Author's Affiliation Mie University (Mie Univ.)
3rd Author's Name Yasuhiro Hattori  
3rd Author's Affiliation AutoNetworks Technologies, Ltd. (AutoNetworks Lab.)
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Speaker Author-1 
Date Time 2011-11-18 09:25:00 
Presentation Time 20 minutes 
Registration for EMD 
Paper # EMD2011-90 
Volume (vol) vol.111 
Number (no) no.299 
Page pp.127-132 
#Pages 6 
Date of Issue 2011-11-10 (EMD) 

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