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Paper Abstract and Keywords
Presentation 2011-11-24 14:30
Design and Evaluation of Bonding Wire Loop Antenna Built into BGA Package on PCB for Short-Range Millimeter Wave Wireless Communication
Yukako Tsutsumi, Takayoshi Ito, Shuichi Obayashi, Hiroki Shoki, Hideo Kasami (Toshiba corp.) MW2011-115 Link to ES Tech. Rep. Archives: MW2011-115
Abstract (in Japanese) (See Japanese page) 
(in English) The 60GHz-band is an unlicensed band in worldwide and expected to be used for the high-speed wireless communications carrying 1Gbps or more. We have investigated a bonding wire loop antenna built into a standard BGA (Ball Grid Array) package for 60 GHz short-range wireless communication. The radiation characteristics of the antenna built into the BGA package vary when it is mounted on the PCB (Print Circuit Board). We describe the design of the metal patterns of the multi-layer PCB to reduce the antenna gain degradation of the built-in bonding wire loop antenna and the measurement results.
Keyword (in Japanese) (See Japanese page) 
(in English) 60GHz / millimeter band / short-range wireless communication / antenna in IC package / bonding wire / PCB / /  
Reference Info. IEICE Tech. Rep., vol. 111, no. 313, MW2011-115, pp. 9-14, Nov. 2011.
Paper # MW2011-115 
Date of Issue 2011-11-17 (MW) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2011-115 Link to ES Tech. Rep. Archives: MW2011-115

Conference Information
Committee MW  
Conference Date 2011-11-24 - 2011-11-25 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave Technologies 
Paper Information
Registration To MW 
Conference Code 2011-11-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Design and Evaluation of Bonding Wire Loop Antenna Built into BGA Package on PCB for Short-Range Millimeter Wave Wireless Communication 
Sub Title (in English)  
Keyword(1) 60GHz  
Keyword(2) millimeter band  
Keyword(3) short-range wireless communication  
Keyword(4) antenna in IC package  
Keyword(5) bonding wire  
Keyword(6) PCB  
1st Author's Name Yukako Tsutsumi  
1st Author's Affiliation Toshiba corporation (Toshiba corp.)
2nd Author's Name Takayoshi Ito  
2nd Author's Affiliation Toshiba corporation (Toshiba corp.)
3rd Author's Name Shuichi Obayashi  
3rd Author's Affiliation Toshiba corporation (Toshiba corp.)
4th Author's Name Hiroki Shoki  
4th Author's Affiliation Toshiba corporation (Toshiba corp.)
5th Author's Name Hideo Kasami  
5th Author's Affiliation Toshiba corporation (Toshiba corp.)
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Date Time 2011-11-24 14:30:00 
Presentation Time 30 minutes 
Registration for MW 
Paper # MW2011-115 
Volume (vol) vol.111 
Number (no) no.313 
Page pp.9-14 
Date of Issue 2011-11-17 (MW) 

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