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Paper Abstract and Keywords
Presentation 2012-08-02 14:40
Intra/Inter Tier Substrate Noise Measurements in 3D ICs
Yasumasa Takagi, Yuuki Araga, Makoto Nagata (Kobe Univ.), Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Michael Libois, Antonio La Manna, Wenqi Zhang, Julien Ryckaert, Eric Beyne (IMEC) SDM2012-72 ICD2012-40 Link to ES Tech. Rep. Archives: SDM2012-72 ICD2012-40
Abstract (in Japanese) (See Japanese page) 
(in English) Substrate noise propagation among stacked dice is evaluated in a 3D test vehicle of 2 tier stacking. Each tier incorporates on-chip monitoring circuits and digital noise source circuits. Silicon measurements show that the substrate noise is attenuated in the propagation between tiers with through silicon vias (TSVs). The effect of p+ guard bands in the stack is also evaluated.
Keyword (in Japanese) (See Japanese page) 
(in English) 3D-LSI / TSV / On-chip testing / / / / /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 170, ICD2012-40, pp. 49-54, Aug. 2012.
Paper # ICD2012-40 
Date of Issue 2012-07-26 (SDM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2012-72 ICD2012-40 Link to ES Tech. Rep. Archives: SDM2012-72 ICD2012-40

Conference Information
Committee ICD SDM  
Conference Date 2012-08-02 - 2012-08-03 
Place (in Japanese) (See Japanese page) 
Place (in English) Sapporo Center for Gender Equality, Sapporo, Hokkaido 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Low-power, low-voltage device and circuit technology 
Paper Information
Registration To ICD 
Conference Code 2012-08-ICD-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Intra/Inter Tier Substrate Noise Measurements in 3D ICs 
Sub Title (in English)  
Keyword(1) 3D-LSI  
Keyword(2) TSV  
Keyword(3) On-chip testing  
Keyword(4)  
Keyword(5)  
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Keyword(8)  
1st Author's Name Yasumasa Takagi  
1st Author's Affiliation Kobe University (Kobe Univ.)
2nd Author's Name Yuuki Araga  
2nd Author's Affiliation Kobe University (Kobe Univ.)
3rd Author's Name Makoto Nagata  
3rd Author's Affiliation Kobe University (Kobe Univ.)
4th Author's Name Geert Van der Plas  
4th Author's Affiliation IMEC (IMEC)
5th Author's Name Jaemin Kim  
5th Author's Affiliation IMEC (IMEC)
6th Author's Name Nikolaos Minas  
6th Author's Affiliation IMEC (IMEC)
7th Author's Name Pol Marchal  
7th Author's Affiliation IMEC (IMEC)
8th Author's Name Michael Libois  
8th Author's Affiliation IMEC (IMEC)
9th Author's Name Antonio La Manna  
9th Author's Affiliation IMEC (IMEC)
10th Author's Name Wenqi Zhang  
10th Author's Affiliation IMEC (IMEC)
11th Author's Name Julien Ryckaert  
11th Author's Affiliation IMEC (IMEC)
12th Author's Name Eric Beyne  
12th Author's Affiliation IMEC (IMEC)
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Speaker Author-1 
Date Time 2012-08-02 14:40:00 
Presentation Time 25 minutes 
Registration for ICD 
Paper # SDM2012-72, ICD2012-40 
Volume (vol) vol.112 
Number (no) no.169(SDM), no.170(ICD) 
Page pp.49-54 
#Pages
Date of Issue 2012-07-26 (SDM, ICD) 


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