Paper Abstract and Keywords |
Presentation |
2012-08-02 14:40
Intra/Inter Tier Substrate Noise Measurements in 3D ICs Yasumasa Takagi, Yuuki Araga, Makoto Nagata (Kobe Univ.), Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Michael Libois, Antonio La Manna, Wenqi Zhang, Julien Ryckaert, Eric Beyne (IMEC) SDM2012-72 ICD2012-40 Link to ES Tech. Rep. Archives: SDM2012-72 ICD2012-40 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Substrate noise propagation among stacked dice is evaluated in a 3D test vehicle of 2 tier stacking. Each tier incorporates on-chip monitoring circuits and digital noise source circuits. Silicon measurements show that the substrate noise is attenuated in the propagation between tiers with through silicon vias (TSVs). The effect of p+ guard bands in the stack is also evaluated. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
3D-LSI / TSV / On-chip testing / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 112, no. 170, ICD2012-40, pp. 49-54, Aug. 2012. |
Paper # |
ICD2012-40 |
Date of Issue |
2012-07-26 (SDM, ICD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
SDM2012-72 ICD2012-40 Link to ES Tech. Rep. Archives: SDM2012-72 ICD2012-40 |
Conference Information |
Committee |
ICD SDM |
Conference Date |
2012-08-02 - 2012-08-03 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Sapporo Center for Gender Equality, Sapporo, Hokkaido |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Low-power, low-voltage device and circuit technology |
Paper Information |
Registration To |
ICD |
Conference Code |
2012-08-ICD-SDM |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Intra/Inter Tier Substrate Noise Measurements in 3D ICs |
Sub Title (in English) |
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Keyword(1) |
3D-LSI |
Keyword(2) |
TSV |
Keyword(3) |
On-chip testing |
Keyword(4) |
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Keyword(5) |
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Keyword(6) |
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Keyword(7) |
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Keyword(8) |
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1st Author's Name |
Yasumasa Takagi |
1st Author's Affiliation |
Kobe University (Kobe Univ.) |
2nd Author's Name |
Yuuki Araga |
2nd Author's Affiliation |
Kobe University (Kobe Univ.) |
3rd Author's Name |
Makoto Nagata |
3rd Author's Affiliation |
Kobe University (Kobe Univ.) |
4th Author's Name |
Geert Van der Plas |
4th Author's Affiliation |
IMEC (IMEC) |
5th Author's Name |
Jaemin Kim |
5th Author's Affiliation |
IMEC (IMEC) |
6th Author's Name |
Nikolaos Minas |
6th Author's Affiliation |
IMEC (IMEC) |
7th Author's Name |
Pol Marchal |
7th Author's Affiliation |
IMEC (IMEC) |
8th Author's Name |
Michael Libois |
8th Author's Affiliation |
IMEC (IMEC) |
9th Author's Name |
Antonio La Manna |
9th Author's Affiliation |
IMEC (IMEC) |
10th Author's Name |
Wenqi Zhang |
10th Author's Affiliation |
IMEC (IMEC) |
11th Author's Name |
Julien Ryckaert |
11th Author's Affiliation |
IMEC (IMEC) |
12th Author's Name |
Eric Beyne |
12th Author's Affiliation |
IMEC (IMEC) |
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Speaker |
Author-1 |
Date Time |
2012-08-02 14:40:00 |
Presentation Time |
25 minutes |
Registration for |
ICD |
Paper # |
SDM2012-72, ICD2012-40 |
Volume (vol) |
vol.112 |
Number (no) |
no.169(SDM), no.170(ICD) |
Page |
pp.49-54 |
#Pages |
6 |
Date of Issue |
2012-07-26 (SDM, ICD) |
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