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Paper Abstract and Keywords
Presentation 2013-01-24 16:00
[Invited Talk] High-density inter-chip interconnects with silicon photonics
Yutaka Urino (PETRA), Tsuyoshi Horikawa (AIST), Takahiro Nakamura (PETRA), Yasuhiko Arakawa (Univ. of Tokyo) PN2012-47 OPE2012-156 LQE2012-148 EST2012-83 MWP2012-65
Abstract (in Japanese) (See Japanese page) 
(in English) One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck for inter-chip interconnects. We propose a photonics-electronics convergence system in response to this issue. To demonstrate the feasibility of the system, we fabricated a high density optical interposer integrated with an arrayed laser diode, spot-size converters, an optical splitter, optical modulators, photodetectors, and optical waveguides on a single silicon substrate. We achieved error free data transmission at 12.5-Gbps and a bandwidth- density of 6.6-Tbps/cm2 with the optical interposer. We believe this technology will solve the bandwidth bottleneck problem in the future.
Keyword (in Japanese) (See Japanese page) 
(in English) integrated optics / integrated optoelectronics / optical interconnects / silicon photonics / / / /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 398, PN2012-47, pp. 103-108, Jan. 2013.
Paper # PN2012-47 
Date of Issue 2013-01-17 (PN, OPE, LQE, EST, MWP) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF PN2012-47 OPE2012-156 LQE2012-148 EST2012-83 MWP2012-65

Conference Information
Committee PN EMT LQE OPE MWP EST IEE-EMT  
Conference Date 2013-01-24 - 2013-01-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Osaka Univ. (Suita) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Photonic integrated circuits and devices, swtiching, PLC, fiber devices, waveguide analysis, and others 
Paper Information
Registration To PN 
Conference Code 2013-01-PN-EMT-LQE-OPE-MWP-EST-EMT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) High-density inter-chip interconnects with silicon photonics 
Sub Title (in English)  
Keyword(1) integrated optics  
Keyword(2) integrated optoelectronics  
Keyword(3) optical interconnects  
Keyword(4) silicon photonics  
Keyword(5)  
Keyword(6)  
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1st Author's Name Yutaka Urino  
1st Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
2nd Author's Name Tsuyoshi Horikawa  
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
3rd Author's Name Takahiro Nakamura  
3rd Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
4th Author's Name Yasuhiko Arakawa  
4th Author's Affiliation Institute of Industrial Science, The University of Tokyo (Univ. of Tokyo)
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Speaker Author-1 
Date Time 2013-01-24 16:00:00 
Presentation Time 35 minutes 
Registration for PN 
Paper # PN2012-47, OPE2012-156, LQE2012-148, EST2012-83, MWP2012-65 
Volume (vol) vol.112 
Number (no) no.398(PN), no.399(OPE), no.400(LQE), no.401(EST), no.402(MWP) 
Page pp.103-108 
#Pages 6 
Date of Issue 2013-01-17 (PN, OPE, LQE, EST, MWP) 

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