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Paper Abstract and Keywords
Presentation 2013-11-16 13:00
Multi-physics Coupling Simulation in the Design of Thermal Overload Relay
Xun Shao, Weihua Wang, Xianping Yuan (Schneider Electric) EMD2013-86
Abstract (in Japanese) (See Japanese page) 
(in English) Abstract: Thermal Overload Relay is a typical product under multi-physics coupling condition. The principle is that bimetal deflects under the effect of electrical, thermal and mechanical, tripping the mechanism till a threshold. This article is to introduce a method of using multi-physics coupling simulation to calculate the bimetal temperature distribution in both transient and steady, and the related bimetal deflection with comparison test results. The method makes it easier and more precise to get bimetal temperature distribution and bimetal deflection, especially when winded by heater, decreases the design cycle time and cost.
Keyword (in Japanese) (See Japanese page) 
(in English) Thermal Overload Relay / Multi-physics Coupling Simulation / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 298, EMD2013-86, pp. 47-49, Nov. 2013.
Paper # EMD2013-86 
Date of Issue 2013-11-09 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMD  
Conference Date 2013-11-16 - 2013-11-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Huazhong University of Science and Technology, Wuhan, P.R.China 
Topics (in Japanese) (See Japanese page) 
Topics (in English) International Session IS-EMD2013 
Paper Information
Registration To EMD 
Conference Code 2013-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Multi-physics Coupling Simulation in the Design of Thermal Overload Relay 
Sub Title (in English)  
Keyword(1) Thermal Overload Relay  
Keyword(2) Multi-physics Coupling Simulation  
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1st Author's Name Xun Shao  
1st Author's Affiliation Schneider Electric (Schneider Electric)
2nd Author's Name Weihua Wang  
2nd Author's Affiliation Schneider Electric (Schneider Electric)
3rd Author's Name Xianping Yuan  
3rd Author's Affiliation Schneider Electric (Schneider Electric)
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Speaker Author-1 
Date Time 2013-11-16 13:00:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2013-86 
Volume (vol) vol.113 
Number (no) no.298 
Page pp.47-49 
#Pages 3 
Date of Issue 2013-11-09 (EMD) 

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