講演抄録/キーワード |
講演名 |
2013-11-17 16:25
Thermal Analysis on Spring Contacts of High Voltage Apparatus ○Ruochen Qiang・Chunping Niu・Xiaohua Wang・Yi Wu・Mingzhe Rong(Xi'an Jiaotong Univ.)・Guangyao Jin(Henan Pinggao Electric) EMD2013-125 エレソ技報アーカイブへのリンク:EMD2013-125 |
抄録 |
(和) |
The thermal phenomena of the spring contacts in high-voltage apparatus is studied. An experimental circuit is built to conduct AC and DC steady-state temperature rise test with the spring contacts as the core unit. For this prototype, a thermal simulation method is provided based on analyzing the principles of heat generation and transfer. By comparing the results of simulation and experiment under different current levels, the effectiveness of simulation method is verified, providing reference for further temperature rise test and design of contact fingers. |
(英) |
The thermal phenomena of the spring contacts in high-voltage apparatus is studied. An experimental circuit is built to conduct AC and DC steady-state temperature rise test with the spring contacts as the core unit. For this prototype, a thermal simulation method is provided based on analyzing the principles of heat generation and transfer. By comparing the results of simulation and experiment under different current levels, the effectiveness of simulation method is verified, providing reference for further temperature rise test and design of contact fingers. |
キーワード |
(和) |
Spring Contact / High Voltage Apparatus / Temperature Rise / Skin Effect / Coupling Area Method / / / |
(英) |
Spring Contact / High Voltage Apparatus / Temperature Rise / Skin Effect / Coupling Area Method / / / |
文献情報 |
信学技報, vol. 113, no. 298, EMD2013-125, pp. 209-212, 2013年11月. |
資料番号 |
EMD2013-125 |
発行日 |
2013-11-09 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
PDFダウンロード |
EMD2013-125 エレソ技報アーカイブへのリンク:EMD2013-125 |