Paper Abstract and Keywords |
Presentation |
2013-11-17 16:25
Thermal Analysis on Spring Contacts of High Voltage Apparatus Ruochen Qiang, Chunping Niu, Xiaohua Wang, Yi Wu, Mingzhe Rong (Xi'an Jiaotong Univ.), Guangyao Jin (Henan Pinggao Electric) EMD2013-125 Link to ES Tech. Rep. Archives: EMD2013-125 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The thermal phenomena of the spring contacts in high-voltage apparatus is studied. An experimental circuit is built to conduct AC and DC steady-state temperature rise test with the spring contacts as the core unit. For this prototype, a thermal simulation method is provided based on analyzing the principles of heat generation and transfer. By comparing the results of simulation and experiment under different current levels, the effectiveness of simulation method is verified, providing reference for further temperature rise test and design of contact fingers. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Spring Contact / High Voltage Apparatus / Temperature Rise / Skin Effect / Coupling Area Method / / / |
Reference Info. |
IEICE Tech. Rep., vol. 113, no. 298, EMD2013-125, pp. 209-212, Nov. 2013. |
Paper # |
EMD2013-125 |
Date of Issue |
2013-11-09 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMD2013-125 Link to ES Tech. Rep. Archives: EMD2013-125 |
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