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Paper Abstract and Keywords
Presentation 2013-11-17 16:25
Thermal Analysis on Spring Contacts of High Voltage Apparatus
Ruochen Qiang, Chunping Niu, Xiaohua Wang, Yi Wu, Mingzhe Rong (Xi'an Jiaotong Univ.), Guangyao Jin (Henan Pinggao Electric) EMD2013-125 Link to ES Tech. Rep. Archives: EMD2013-125
Abstract (in Japanese) (See Japanese page) 
(in English) The thermal phenomena of the spring contacts in high-voltage apparatus is studied. An experimental circuit is built to conduct AC and DC steady-state temperature rise test with the spring contacts as the core unit. For this prototype, a thermal simulation method is provided based on analyzing the principles of heat generation and transfer. By comparing the results of simulation and experiment under different current levels, the effectiveness of simulation method is verified, providing reference for further temperature rise test and design of contact fingers.
Keyword (in Japanese) (See Japanese page) 
(in English) Spring Contact / High Voltage Apparatus / Temperature Rise / Skin Effect / Coupling Area Method / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 298, EMD2013-125, pp. 209-212, Nov. 2013.
Paper # EMD2013-125 
Date of Issue 2013-11-09 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2013-125 Link to ES Tech. Rep. Archives: EMD2013-125

Conference Information
Committee EMD  
Conference Date 2013-11-16 - 2013-11-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Huazhong University of Science and Technology, Wuhan, P.R.China 
Topics (in Japanese) (See Japanese page) 
Topics (in English) International Session IS-EMD2013 
Paper Information
Registration To EMD 
Conference Code 2013-11-EMD 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Thermal Analysis on Spring Contacts of High Voltage Apparatus 
Sub Title (in English)  
Keyword(1) Spring Contact  
Keyword(2) High Voltage Apparatus  
Keyword(3) Temperature Rise  
Keyword(4) Skin Effect  
Keyword(5) Coupling Area Method  
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1st Author's Name Ruochen Qiang  
1st Author's Affiliation Xi'an Jiaotong University (Xi'an Jiaotong Univ.)
2nd Author's Name Chunping Niu  
2nd Author's Affiliation Xi'an Jiaotong University (Xi'an Jiaotong Univ.)
3rd Author's Name Xiaohua Wang  
3rd Author's Affiliation Xi'an Jiaotong University (Xi'an Jiaotong Univ.)
4th Author's Name Yi Wu  
4th Author's Affiliation Xi'an Jiaotong University (Xi'an Jiaotong Univ.)
5th Author's Name Mingzhe Rong  
5th Author's Affiliation Xi'an Jiaotong University (Xi'an Jiaotong Univ.)
6th Author's Name Guangyao Jin  
6th Author's Affiliation Henan Pinggao Electric Co.,Ltd (Henan Pinggao Electric)
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Speaker Author-1 
Date Time 2013-11-17 16:25:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2013-125 
Volume (vol) vol.113 
Number (no) no.298 
Page pp.209-212 
#Pages
Date of Issue 2013-11-09 (EMD) 


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