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Paper Abstract and Keywords
Presentation 2013-11-28 10:55
A thermal analysis algorithm for VLSI chip by GPGPU
Takashi Ohmura, Lei Lin, Lin Meng, Masahiro Fukui (Ritsumeikan Univ.) VLD2013-89 DC2013-55
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, since the heat problem of the circuit accompanying high integration of the circuit is remarkable, thermal analysis becomes important. The computational complexity of a thermal-analysis simulation is huge, hence improving the processing speed is significant. We realized the speed up of the power grid circuit simulation by GPGPU. This research aims to realize thermal-analysis simulation by a thermal network method, and uses the speed-up techniques of the power grid circuit simulation by GPGPU to improve the simulation speed. At first, we proposed a two-dimensional thermal network model which expresses three-dimensional heat conduction approximately. Then, we solved the analytical calculation by backward Euler method to the model by the Jacobi method which parallelized, and it performed the high-speed simulation together with the increase in efficiency by compression of a circuit matrix. As a result, we realized 143 times acceleration of the simulation compared with execution by CPU only.
Keyword (in Japanese) (See Japanese page) 
(in English) GPGPU / thermal analysis / backward Euler method / / / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 320, VLD2013-89, pp. 209-214, Nov. 2013.
Paper # VLD2013-89 
Date of Issue 2013-11-20 (VLD, DC) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2013-89 DC2013-55

Conference Information
Committee VLD DC IPSJ-SLDM CPSY RECONF ICD CPM  
Conference Date 2013-11-27 - 2013-11-29 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English) Design Gaia 2013 -New Field of VLSI Design- 
Paper Information
Registration To VLD 
Conference Code 2013-11-VLD-DC-SLDM-CPSY-RECONF-ICD-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A thermal analysis algorithm for VLSI chip by GPGPU 
Sub Title (in English)  
Keyword(1) GPGPU  
Keyword(2) thermal analysis  
Keyword(3) backward Euler method  
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1st Author's Name Takashi Ohmura  
1st Author's Affiliation Ritsumrikan University (Ritsumeikan Univ.)
2nd Author's Name Lei Lin  
2nd Author's Affiliation Ritsumrikan University (Ritsumeikan Univ.)
3rd Author's Name Lin Meng  
3rd Author's Affiliation Ritsumrikan University (Ritsumeikan Univ.)
4th Author's Name Masahiro Fukui  
4th Author's Affiliation Ritsumrikan University (Ritsumeikan Univ.)
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Speaker Author-1 
Date Time 2013-11-28 10:55:00 
Presentation Time 25 minutes 
Registration for VLD 
Paper # VLD2013-89, DC2013-55 
Volume (vol) vol.113 
Number (no) no.320(VLD), no.321(DC) 
Page pp.209-214 
#Pages 6 
Date of Issue 2013-11-20 (VLD, DC) 

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