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Paper Abstract and Keywords
Presentation 2014-01-30 14:30
Optimization of the inter-layer connection structure for the high-speed signal
Tsuyoshi Kobayashi, Kouji Shibuya (Mitsubishi Electric), Norio Takeuchi, Kenji Maeda (Mitsubishi Electric Engineering) EMCJ2013-115
Abstract (in Japanese) (See Japanese page) 
(in English) For a miniaturization and advanced features of equipment, the high-density and quality PCB design is required.Through hole is used, when changing the wiring layers in the printed circuit board. Usually, through-hole has one or two GND via in the vicinity, to provide the return current path. But, digital transmission speed has accelerate. And, high speed signal contains a higher frequency. By a through hole, there is a possibility that signal energy may be leaked to an inner layer. It is the loss of signal. In this study, we simulated the number and placement of GND vias surrounding the through-hole, the relationship of the amount of loss that leaks in the inner layer.
Keyword (in Japanese) (See Japanese page) 
(in English) PCB design / Through-hole / Signal Integrity / / / / /  
Reference Info. IEICE Tech. Rep., vol. 113, no. 423, EMCJ2013-115, pp. 23-26, Jan. 2014.
Paper # EMCJ2013-115 
Date of Issue 2014-01-23 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2013-115

Conference Information
Committee EMCJ WPT  
Conference Date 2014-01-30 - 2014-01-31 
Place (in Japanese) (See Japanese page) 
Place (in English) Saga Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Communication, Wireless power transmission, EMC, etc. 
Paper Information
Registration To EMCJ 
Conference Code 2014-01-EMCJ-WPT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Optimization of the inter-layer connection structure for the high-speed signal 
Sub Title (in English)  
Keyword(1) PCB design  
Keyword(2) Through-hole  
Keyword(3) Signal Integrity  
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1st Author's Name Tsuyoshi Kobayashi  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
2nd Author's Name Kouji Shibuya  
2nd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
3rd Author's Name Norio Takeuchi  
3rd Author's Affiliation Mitsubishi Electric Engineering Corporation (Mitsubishi Electric Engineering)
4th Author's Name Kenji Maeda  
4th Author's Affiliation Mitsubishi Electric Engineering Corporation (Mitsubishi Electric Engineering)
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Speaker Author-1 
Date Time 2014-01-30 14:30:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2013-115 
Volume (vol) vol.113 
Number (no) no.423 
Page pp.23-26 
#Pages 4 
Date of Issue 2014-01-23 (EMCJ) 

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