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Paper Abstract and Keywords
Presentation 2014-06-20 10:35
Side-Channel Leakage on Silicon Substrate of CMOS Cryptographic Chip
Daisuke Fujimoto, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Yu-ichi Hayashi, Naofumi Homma (Tohoku Univ.), Shivam Bhasin, Jean-Luc Danger (Telecom Paristech) EMCJ2014-10
Abstract (in Japanese) (See Japanese page) 
(in English) Power supply currents of CMOS digital circuits partly flow through a silicon substrate in their returning (ground) paths. The voltage bounce due to the substrate currents is seen wherever p+ substrate taps on a p-type die and regarded as a substrate noise. An on-chip waveform monitor confirms the side-channel leakage on the silicon substrate from an AES cryptographic module in a 65 nm CMOS demonstrator chip for the first time. The silicon substrate is essentially common to every circuit and inevitably carries the leakage to the observation taps located at the front as well as at the bottom surface of a die, even if the power and ground wires of an AES module are intentionally separated from the other building blocks. Substrate leakage channels may break the hiding of a cryptographic module regarding its location on a die. The physical properties including the distance dependency are experimentally explored.
Keyword (in Japanese) (See Japanese page) 
(in English) Side-channel attack / Power analysis attack / On-chip monitor / substrate noise / / / /  
Reference Info. IEICE Tech. Rep., vol. 114, no. 93, EMCJ2014-10, pp. 1-6, June 2014.
Paper # EMCJ2014-10 
Date of Issue 2014-06-13 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMCJ IEE-EMC  
Conference Date 2014-06-20 - 2014-06-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kobe Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) PCB, Information Security, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2014-06-EMCJ-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Side-Channel Leakage on Silicon Substrate of CMOS Cryptographic Chip 
Sub Title (in English)  
Keyword(1) Side-channel attack  
Keyword(2) Power analysis attack  
Keyword(3) On-chip monitor  
Keyword(4) substrate noise  
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1st Author's Name Daisuke Fujimoto  
1st Author's Affiliation Kobe University (Kobe Univ.)
2nd Author's Name Noriyuki Miura  
2nd Author's Affiliation Kobe University (Kobe Univ.)
3rd Author's Name Makoto Nagata  
3rd Author's Affiliation Kobe University (Kobe Univ.)
4th Author's Name Yu-ichi Hayashi  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Naofumi Homma  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Shivam Bhasin  
6th Author's Affiliation Telecom Paristech (Telecom Paristech)
7th Author's Name Jean-Luc Danger  
7th Author's Affiliation Telecom Paristech (Telecom Paristech)
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Speaker Author-1 
Date Time 2014-06-20 10:35:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2014-10 
Volume (vol) vol.114 
Number (no) no.93 
Page pp.1-6 
#Pages
Date of Issue 2014-06-13 (EMCJ) 


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