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Paper Abstract and Keywords
Presentation 2015-06-19 11:35
Evaluation of the third Flex Power FPGA chip in SOTB technology
Masakazu Hioki, Yasuhiro Ogasahara, Hanpei Koike (AIST) RECONF2015-3
Abstract (in Japanese) (See Japanese page) 
(in English) This paper reports the evaluation of the third Flex Power FPGA chip in SOTB technology. Fabricated chip aims to shrink an FPGA tile footprint. 2.25 times FPGA tiles can be integrated compared to previously fabricated chip by reducing design margins and by redesigning back bias circuits. Moreover, power reduction efficiency of fabricated chip is referred in case that a 32bit binary counter circuit is implemented.
Keyword (in Japanese) (See Japanese page) 
(in English) Silicon On Thin BOX / SOTB / Flex Power FPGA / FPGA / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 109, RECONF2015-3, pp. 13-16, June 2015.
Paper # RECONF2015-3 
Date of Issue 2015-06-12 (RECONF) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Notes on Review This article is a technical report without peer review, and its polished version will be published elsewhere.
Download PDF RECONF2015-3

Conference Information
Committee RECONF  
Conference Date 2015-06-19 - 2015-06-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Kyoto University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) the 10th anniversary celebration of RECONF: Reconfigurable Systems, etc. 
Paper Information
Registration To RECONF 
Conference Code 2015-06-RECONF 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Evaluation of the third Flex Power FPGA chip in SOTB technology 
Sub Title (in English)  
Keyword(1) Silicon On Thin BOX  
Keyword(2) SOTB  
Keyword(3) Flex Power FPGA  
Keyword(4) FPGA  
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1st Author's Name Masakazu Hioki  
1st Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
2nd Author's Name Yasuhiro Ogasahara  
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
3rd Author's Name Hanpei Koike  
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
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Speaker Author-1 
Date Time 2015-06-19 11:35:00 
Presentation Time 25 minutes 
Registration for RECONF 
Paper # RECONF2015-3 
Volume (vol) vol.115 
Number (no) no.109 
Page pp.13-16 
#Pages 4 
Date of Issue 2015-06-12 (RECONF) 

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