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Paper Abstract and Keywords
Presentation 2015-07-16 13:50
RFIC Flip-Chip Interconnection Using a Fiber Type Anisotropic Conductive Film
Takeo Owada, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) EMT2015-14 MW2015-52 OPE2015-26 EST2015-18 MWP2015-17
Abstract (in Japanese) (See Japanese page) 
(in English) RFIC flip-chip mounting technique is important to realize compact and high-performance transceivers like mobile phones. The conventional flip-chip mounting uses Au stud bump bonding (SBB) and needs complicated process including formation and flattening of the Au bumps. In order to simplify the RFIC flip-chip process, we introduce a fiber type anisotropic conductive film (ACF). This flip chip mounting process was developed for low frequency IC’s having large umber I/O pins and does not require the bump bonding and flattening process. The interconnection between the RFIC and the substrate is confirmed by the 3D-CT images and the RF performance is measured and compared with conventional Au SBB. The measured result shows the inferior performance to Au SBB, but it shows return loss of more than 10dB below frequency of 4.2GHz.
Keyword (in Japanese) (See Japanese page) 
(in English) flip chip / microwave / packaging / RFIC / anisotropic conductive film / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 142, MW2015-52, pp. 35-39, July 2015.
Paper # MW2015-52 
Date of Issue 2015-07-09 (EMT, MW, OPE, EST, MWP) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMT2015-14 MW2015-52 OPE2015-26 EST2015-18 MWP2015-17

Conference Information
Committee EMT MW OPE MWP EST IEE-EMT  
Conference Date 2015-07-16 - 2015-07-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Kushiro City Lifelong Learning Center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Light wave & Electromagnetic Wave Workshop 
Paper Information
Registration To MW 
Conference Code 2015-07-EMT-MW-OPE-MWP-EST-EMT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) RFIC Flip-Chip Interconnection Using a Fiber Type Anisotropic Conductive Film 
Sub Title (in English)  
Keyword(1) flip chip  
Keyword(2) microwave  
Keyword(3) packaging  
Keyword(4) RFIC  
Keyword(5) anisotropic conductive film  
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1st Author's Name Takeo Owada  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Mizuki Motoyoshi  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Suguru Kameda  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Noriharu Suematsu  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Tadashi Takagi  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Kazuo Tsubouchi  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
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Speaker Author-1 
Date Time 2015-07-16 13:50:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # EMT2015-14, MW2015-52, OPE2015-26, EST2015-18, MWP2015-17 
Volume (vol) vol.115 
Number (no) no.141(EMT), no.142(MW), no.143(OPE), no.144(EST), no.145(MWP) 
Page pp.35-39 
#Pages 5 
Date of Issue 2015-07-09 (EMT, MW, OPE, EST, MWP) 

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