Paper Abstract and Keywords |
Presentation |
2015-10-23 09:50
Analysis of electromagnetic coupling between ground slot in each layer in PCB Teruo Tobana, Takayuki Sasamori, Yoji Isota (Akita Pref. Univ.) EMCJ2015-72 MW2015-111 EST2015-82 Link to ES Tech. Rep. Archives: MW2015-111 EST2015-82 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Recently, by advance of miniaturization of electronic devices,
a ground of a printed circuit board is tend to be small and complicated
and the ground may have some defects,
such as connectors or clearance halls of vias.
In multi-layere PCB,
they may cause of the cross-talk between any lines.
In this paper,
we consider using the spectral domain method
when per-unit-length parameters between slots
in a ground on a each layer of 2 layers PCB is calculated.
And, we calculate the crosstalk between ground slots,
using the MTL method and the calculated parameters.
By comparing results by the multi-transmission line method
with results by the FDTD method,
we show that both results has about same tendency except for
inconsistency values and
this method can effectively calculate the crosstalk
between the slots using MTL method. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
multiconductor-transmission-line / ground slot / electromagnetic coupling / spectral domain method / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 115, no. 259, EMCJ2015-72, pp. 87-90, Oct. 2015. |
Paper # |
EMCJ2015-72 |
Date of Issue |
2015-10-15 (EMCJ, MW, EST) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMCJ2015-72 MW2015-111 EST2015-82 Link to ES Tech. Rep. Archives: MW2015-111 EST2015-82 |
Conference Information |
Committee |
EMCJ IEE-EMC MW EST |
Conference Date |
2015-10-22 - 2015-10-23 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Sakura Hall, Katahira Campus, Tohoku Univ. |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Microwave, Electromagnetic simulation, EMC, etc. |
Paper Information |
Registration To |
EMCJ |
Conference Code |
2015-10-EMCJ-EMC-MW-EST |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Analysis of electromagnetic coupling between ground slot in each layer in PCB |
Sub Title (in English) |
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Keyword(1) |
multiconductor-transmission-line |
Keyword(2) |
ground slot |
Keyword(3) |
electromagnetic coupling |
Keyword(4) |
spectral domain method |
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1st Author's Name |
Teruo Tobana |
1st Author's Affiliation |
Akita Prefectural University (Akita Pref. Univ.) |
2nd Author's Name |
Takayuki Sasamori |
2nd Author's Affiliation |
Akita Prefectural University (Akita Pref. Univ.) |
3rd Author's Name |
Yoji Isota |
3rd Author's Affiliation |
Akita Prefectural University (Akita Pref. Univ.) |
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Speaker |
Author-1 |
Date Time |
2015-10-23 09:50:00 |
Presentation Time |
25 minutes |
Registration for |
EMCJ |
Paper # |
EMCJ2015-72, MW2015-111, EST2015-82 |
Volume (vol) |
vol.115 |
Number (no) |
no.259(EMCJ), no.260(MW), no.261(EST) |
Page |
pp.87-90 |
#Pages |
4 |
Date of Issue |
2015-10-15 (EMCJ, MW, EST) |
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