Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2016-01-22 11:35
In-situ ellipsometry of Cu surfaces immersed in BTA-H2O2 solutions
Tatsuya Kawakami, Eiichi Kondoh, Mitsuhiro Watanabe (University of Yamanashi), Satomi Hamada, Shohei Shima, Hirokuni Hiyama (Ebara Corporation) SDM2015-111
Abstract (in Japanese) (See Japanese page) 
(in English) During Cu CMP, Cu surface is oxidized by an oxidizer or a complexiation reagent. To inhibit oxidation, a corrosion inhibitor is co-added in the slurry. Balancing oxidation and surface passivation is of importance in advanced Cu CMP. Layer formation onto clean Cu surfaces in BTA (C6H5N3)-H2O2 aqueous solutions was studied by using in-situ spectroscopic ellipsometry. Time changes in an ellipsometric parameter, Δ, which corresponds to the layer thickening, were discussed with respect to BTA and H2O2 concentrations. BTA forms a passivation layer and the oxidation from H2O2 precedes that. Too high addition of BTA accelerates the layer formation.
Keyword (in Japanese) (See Japanese page) 
(in English) Chemical mechanical polishing / In-situ measurement / Ellipsometry / Copper / / / /  
Reference Info. IEICE Tech. Rep., vol. 115, no. 417, SDM2015-111, pp. 13-15, Jan. 2016.
Paper # SDM2015-111 
Date of Issue 2016-01-15 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2015-111

Conference Information
Committee SDM  
Conference Date 2016-01-22 - 2016-01-22 
Place (in Japanese) (See Japanese page) 
Place (in English) Sanjo Conference Hall, The University of Tokyo 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Interconnects, Package and related materials 
Paper Information
Registration To SDM 
Conference Code 2016-01-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) In-situ ellipsometry of Cu surfaces immersed in BTA-H2O2 solutions 
Sub Title (in English)  
Keyword(1) Chemical mechanical polishing  
Keyword(2) In-situ measurement  
Keyword(3) Ellipsometry  
Keyword(4) Copper  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Tatsuya Kawakami  
1st Author's Affiliation University of Yamanashi (University of Yamanashi)
2nd Author's Name Eiichi Kondoh  
2nd Author's Affiliation University of Yamanashi (University of Yamanashi)
3rd Author's Name Mitsuhiro Watanabe  
3rd Author's Affiliation University of Yamanashi (University of Yamanashi)
4th Author's Name Satomi Hamada  
4th Author's Affiliation Ebara Corporation (Ebara Corporation)
5th Author's Name Shohei Shima  
5th Author's Affiliation Ebara Corporation (Ebara Corporation)
6th Author's Name Hirokuni Hiyama  
6th Author's Affiliation Ebara Corporation (Ebara Corporation)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2016-01-22 11:35:00 
Presentation Time 20 minutes 
Registration for SDM 
Paper # SDM2015-111 
Volume (vol) vol.115 
Number (no) no.417 
Page pp.13-15 
#Pages 3 
Date of Issue 2016-01-15 (SDM) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan