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Paper Abstract and Keywords
Presentation 2016-01-28 14:25
A Study of the Crosstalk and the High-Density Package of the Single-ended Transmission Line
Takashi Kuwahara, Yoshihiro Akeboshi (MitsubishiElectric), Seiichi Saito (Salesian Polytechnic) EMCJ2015-110
Abstract (in Japanese) (See Japanese page) 
(in English) With improvement in the speed of digital equipment in recent years, for example of DDR memory, the number of high-speed single-ended signal transmission line increases abundantly by many lanes in the circuit substrate. And it has been a subject what density growth of the gap between the inside of a signal wire pair or a pair is packed and carried out. Then, writers examined the cross-sectional shape which can reduce the basis of the conditions that signal conductor section area and signal wiring efficiency (occupied area) are certain, and the amount of cross talks by changing the conventional not the oblong form where the neighborhood parallel to a substrate side is long but form for signal wire cross-sectional shape . We report the simulated results and observation result of the prototype circuit board now.
Keyword (in Japanese) (See Japanese page) 
(in English) Crosstalk / NEXT / FEXT / Conductor Shape / Single-ended Line / High-Density Package / MSL / Xtalk  
Reference Info. IEICE Tech. Rep., vol. 115, no. 427, EMCJ2015-110, pp. 37-42, Jan. 2016.
Paper # EMCJ2015-110 
Date of Issue 2016-01-21 (EMCJ) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2015-110

Conference Information
Committee EMCJ WPT  
Conference Date 2016-01-28 - 2016-01-29 
Place (in Japanese) (See Japanese page) 
Place (in English) Kumamoto National Colle. Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Communication, Wireless Power Transmission, EMC 
Paper Information
Registration To EMCJ 
Conference Code 2016-01-EMCJ-WPT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study of the Crosstalk and the High-Density Package of the Single-ended Transmission Line 
Sub Title (in English)  
Keyword(1) Crosstalk  
Keyword(2) NEXT  
Keyword(3) FEXT  
Keyword(4) Conductor Shape  
Keyword(5) Single-ended Line  
Keyword(6) High-Density Package  
Keyword(7) MSL  
Keyword(8) Xtalk  
1st Author's Name Takashi Kuwahara  
1st Author's Affiliation Mitsubishi Electric Corporation (MitsubishiElectric)
2nd Author's Name Yoshihiro Akeboshi  
2nd Author's Affiliation Mitsubishi Electric Corporation (MitsubishiElectric)
3rd Author's Name Seiichi Saito  
3rd Author's Affiliation Salesian Polytechnic (Salesian Polytechnic)
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Speaker Author-1 
Date Time 2016-01-28 14:25:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2015-110 
Volume (vol) vol.115 
Number (no) no.427 
Page pp.37-42 
#Pages 6 
Date of Issue 2016-01-21 (EMCJ) 

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