Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2016-06-17 16:20
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki) EMD2016-15 CPM2016-22 OME2016-25
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards. When a discharge current from a capacitor bank passes through a one-turn flat coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in an insulated aluminum driver sheet and the copper foils placed on the coil. The foils have a gap between them. Electromagnetic force acts on the driver sheet nearer the coil and accelerates the sheet and lets the foils collide. The foils are welded with the bank energy less than 1.2 kJ. Experimental results including the interfacial observation are reported.
Keyword (in Japanese) (See Japanese page) 
(in English) Printed circuit board / Rigid board / Flexible board / Copper foil / Magnetic pulse welding / Interfacial observation / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 99, EMD2016-15, pp. 39-42, June 2016.
Paper # EMD2016-15 
Date of Issue 2016-06-10 (EMD, CPM, OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2016-15 CPM2016-22 OME2016-25

Conference Information
Committee EMD CPM OME  
Conference Date 2016-06-17 - 2016-06-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Marterial・Device Summer Meeting 
Paper Information
Registration To EMD 
Conference Code 2016-06-EMD-CPM-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report) 
Sub Title (in English)  
Keyword(1) Printed circuit board  
Keyword(2) Rigid board  
Keyword(3) Flexible board  
Keyword(4) Copper foil  
Keyword(5) Magnetic pulse welding  
Keyword(6) Interfacial observation  
Keyword(7)  
Keyword(8)  
1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Technology (Tokyo Metropolitan College)
2nd Author's Name Yoshitaka Sugiyama  
2nd Author's Affiliation Yazaki Corporation (Yazaki)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2016-06-17 16:20:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMD2016-15, CPM2016-22, OME2016-25 
Volume (vol) vol.116 
Number (no) no.99(EMD), no.100(CPM), no.101(OME) 
Page pp.39-42 
#Pages 4 
Date of Issue 2016-06-10 (EMD, CPM, OME) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan