Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2016-08-01 09:15
[Invited Talk] Accelerating the Sensing World through Imaging Evolution
Yusuke Oike, Hayato Wakabayashi, Tetuo Nomoto (Sony Semiconductor Solutions) SDM2016-48 ICD2016-16
Abstract (in Japanese) (See Japanese page) 
(in English) This presentation introduces the evolution of image sensors and the future prospect of sensing applications utilizing the imaging technologies, which was presented as a plenary talk at IEEE Symposium on VLSI Circuits 2016 [1]. The evolution of CMOS image sensors (CIS) and the future prospect of a “sensing” world utilizing advanced imaging technologies promise to improve our quality of life by sensing anything, anywhere, anytime. Charge Coupled Device image sensors replaced video camera tubes, allowing the introduction of compact video cameras as consumer products. CIS now dominates the market for digital still cameras created by its predecessor and, with the advent of column-parallel ADCs and back-illuminated technologies, outperforms them. CIS’s achieve better signal to noise ratio, lower power consumption, and higher frame rate [1-5]. Stacked CIS's continue to enhance functionality and user experience in mobile devices, a market that currently comprises over one billion units per year [6-7]. CIS imaging technologies promise to accelerate the progress of sensing world by continuously improving sensitivity, extending detectable wave-lengths, and further improving depth resolution and temporal resolution [8-10].
Keyword (in Japanese) (See Japanese page) 
(in English) CCD / CMOS image sensor / buck illuminated CMOS image sensor / 3D integration / / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 173, ICD2016-16, pp. 1-1, Aug. 2016.
Paper # ICD2016-16 
Date of Issue 2016-07-25 (SDM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2016-48 ICD2016-16

Conference Information
Committee ICD SDM ITE-IST  
Conference Date 2016-08-01 - 2016-08-03 
Place (in Japanese) (See Japanese page) 
Place (in English) Central Electric Club 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low voltage/low power techniques, novel devices, circuits, and applications 
Paper Information
Registration To ICD 
Conference Code 2016-08-ICD-SDM-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Accelerating the Sensing World through Imaging Evolution 
Sub Title (in English)  
Keyword(1) CCD  
Keyword(2) CMOS image sensor  
Keyword(3) buck illuminated CMOS image sensor  
Keyword(4) 3D integration  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yusuke Oike  
1st Author's Affiliation Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions)
2nd Author's Name Hayato Wakabayashi  
2nd Author's Affiliation Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions)
3rd Author's Name Tetuo Nomoto  
3rd Author's Affiliation Sony Semiconductor Solutions Corporation (Sony Semiconductor Solutions)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2016-08-01 09:15:00 
Presentation Time 45 minutes 
Registration for ICD 
Paper # SDM2016-48, ICD2016-16 
Volume (vol) vol.116 
Number (no) no.172(SDM), no.173(ICD) 
Page p.1 
#Pages 1 
Date of Issue 2016-07-25 (SDM, ICD) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan