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Paper Abstract and Keywords
Presentation 2016-08-25 09:45
Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate.
Motoyuki Nishizawa, Nobuaki Hatori, Yu Tanaka, Mitsuru Kurihara, Kazuhiko Kurata (PETRA) R2016-20 EMD2016-24 CPM2016-33 OPE2016-54 LQE2016-29
Abstract (in Japanese) (See Japanese page) 
(in English) We are developing packaging technology of hybrid integrated light sources on Silicon platform for realization high capacity optical I/O with Si photonics technology for high-end server and next-generation supercomputers. 16-channel hybrid integrated light sources were developed by flip-chip-mounting laser diode (LD) arrays on Si platform fabricated at a foundry. 16-wavelength lasing was demonstrated as an example. On the other hand, we designed and fabricated the plastic packaging structure considering a cooling of LD arrays. We have realized sufficient optical couplings between LD and Si waveguides at all channels. Furthermore, we have found that the optical resin used for optical coupling had enough resistance to both solder reflow and flux washing when an optical I/O was mounted on a CPU package.
Keyword (in Japanese) (See Japanese page) 
(in English) silicon photonics / optical interconnect / laser diode / flip-chip maounting / integrated light source / plastic packaging / reflow treatment /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 195, LQE2016-29, pp. 5-8, Aug. 2016.
Paper # LQE2016-29 
Date of Issue 2016-08-18 (R, EMD, CPM, OPE, LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2016-20 EMD2016-24 CPM2016-33 OPE2016-54 LQE2016-29

Conference Information
Committee LQE OPE EMD R CPM  
Conference Date 2016-08-25 - 2016-08-26 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To LQE 
Conference Code 2016-08-LQE-OPE-EMD-R-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Packaging of 16ch (4chx4) Integrated Light Sources with Laser Diode Arrays on Silicon Substrate. 
Sub Title (in English)  
Keyword(1) silicon photonics  
Keyword(2) optical interconnect  
Keyword(3) laser diode  
Keyword(4) flip-chip maounting  
Keyword(5) integrated light source  
Keyword(6) plastic packaging  
Keyword(7) reflow treatment  
Keyword(8)  
1st Author's Name Motoyuki Nishizawa  
1st Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
2nd Author's Name Nobuaki Hatori  
2nd Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
3rd Author's Name Yu Tanaka  
3rd Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
4th Author's Name Mitsuru Kurihara  
4th Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
5th Author's Name Kazuhiko Kurata  
5th Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
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Speaker Author-1 
Date Time 2016-08-25 09:45:00 
Presentation Time 25 minutes 
Registration for LQE 
Paper # R2016-20, EMD2016-24, CPM2016-33, OPE2016-54, LQE2016-29 
Volume (vol) vol.116 
Number (no) no.191(R), no.192(EMD), no.193(CPM), no.194(OPE), no.195(LQE) 
Page pp.5-8 
#Pages 4 
Date of Issue 2016-08-18 (R, EMD, CPM, OPE, LQE) 

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