Paper Abstract and Keywords |
Presentation |
2016-11-29 10:30
[Invited Talk]
Development of Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel Signal Processors by Using Direct Bonding of SOI Layers Masahide Goto, Yuki Honda, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi (NHK), Takuya Saraya, Masaharu Kobayashi, Eiji Higurasgi, Hiroshi Toshiyoshi, Toshiro Hiramoto (Univ. Tokyo) CPM2016-79 ICD2016-40 IE2016-74 Link to ES Tech. Rep. Archives: CPM2016-79 ICD2016-40 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
(Not available yet) |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
/ / / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 116, no. 333, CPM2016-79, pp. 17-21, Nov. 2016. |
Paper # |
CPM2016-79 |
Date of Issue |
2016-11-22 (CPM, ICD, IE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
CPM2016-79 ICD2016-40 IE2016-74 Link to ES Tech. Rep. Archives: CPM2016-79 ICD2016-40 |