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Paper Abstract and Keywords
Presentation 2017-02-17 16:00
Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices
Osmau Ohtani, Tomohiro Fukuhara (Omron Corp.) R2016-68 EMD2016-95 Link to ES Tech. Rep. Archives: EMD2016-95
Abstract (in Japanese) (See Japanese page) 
(in English) The adhesives for the mechanical device such as Relay or Switch are required the tracking resistance, the contact reliability and the sealing property in addition to the adhesiveness. Generally, One-part epoxy resin is used as fulfill the above mentioned functions and productivity. It consists of liquid epoxy monomer, solid curing agent, and inorganic filler. As the functions are performed by the chemical reaction between liquid epoxy monomer and solid curing, the improvement of these two molecular structures was lead to a performance of the adhesives.
On the other hand, the influence of the filler had not investigated without improving the mechanical property and the thermal characteristic. In this report, as focusing functionalization of the filler, we revealed that the class and particle diameter of the filler is influenced on the tracking resistance, the contact reliability, and sealing property.
Keyword (in Japanese) (See Japanese page) 
(in English) Electromechanical Device / Adhesion Reliabity / One-part epoxy resin / / / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 459, EMD2016-95, pp. 49-52, Feb. 2017.
Paper # EMD2016-95 
Date of Issue 2017-02-10 (R, EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMD R  
Conference Date 2017-02-17 - 2017-02-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Omuron Kusatsu Factory 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2017-02-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices 
Sub Title (in English)  
Keyword(1) Electromechanical Device  
Keyword(2) Adhesion Reliabity  
Keyword(3) One-part epoxy resin  
1st Author's Name Osmau Ohtani  
1st Author's Affiliation Omron Corporation (Omron Corp.)
2nd Author's Name Tomohiro Fukuhara  
2nd Author's Affiliation Omron Corporation (Omron Corp.)
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Speaker Author-1 
Date Time 2017-02-17 16:00:00 
Presentation Time 20 minutes 
Registration for EMD 
Paper # R2016-68, EMD2016-95 
Volume (vol) vol.116 
Number (no) no.458(R), no.459(EMD) 
Page pp.49-52 
Date of Issue 2017-02-10 (R, EMD) 

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