Paper Abstract and Keywords |
Presentation |
2017-02-17 16:00
Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices Osmau Ohtani, Tomohiro Fukuhara (Omron Corp.) R2016-68 EMD2016-95 Link to ES Tech. Rep. Archives: EMD2016-95 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The adhesives for the mechanical device such as Relay or Switch are required the tracking resistance, the contact reliability and the sealing property in addition to the adhesiveness. Generally, One-part epoxy resin is used as fulfill the above mentioned functions and productivity. It consists of liquid epoxy monomer, solid curing agent, and inorganic filler. As the functions are performed by the chemical reaction between liquid epoxy monomer and solid curing, the improvement of these two molecular structures was lead to a performance of the adhesives.
On the other hand, the influence of the filler had not investigated without improving the mechanical property and the thermal characteristic. In this report, as focusing functionalization of the filler, we revealed that the class and particle diameter of the filler is influenced on the tracking resistance, the contact reliability, and sealing property. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Electromechanical Device / Adhesion Reliabity / One-part epoxy resin / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 116, no. 459, EMD2016-95, pp. 49-52, Feb. 2017. |
Paper # |
EMD2016-95 |
Date of Issue |
2017-02-10 (R, EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
R2016-68 EMD2016-95 Link to ES Tech. Rep. Archives: EMD2016-95 |
Conference Information |
Committee |
EMD R |
Conference Date |
2017-02-17 - 2017-02-17 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Omuron Kusatsu Factory |
Topics (in Japanese) |
(See Japanese page) |
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Paper Information |
Registration To |
EMD |
Conference Code |
2017-02-EMD-R |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Study on the Relation between Filler of the Adhesive and Functions of Mechanical Devices |
Sub Title (in English) |
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Keyword(1) |
Electromechanical Device |
Keyword(2) |
Adhesion Reliabity |
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One-part epoxy resin |
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1st Author's Name |
Osmau Ohtani |
1st Author's Affiliation |
Omron Corporation (Omron Corp.) |
2nd Author's Name |
Tomohiro Fukuhara |
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Omron Corporation (Omron Corp.) |
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Speaker |
Author-1 |
Date Time |
2017-02-17 16:00:00 |
Presentation Time |
20 minutes |
Registration for |
EMD |
Paper # |
R2016-68, EMD2016-95 |
Volume (vol) |
vol.116 |
Number (no) |
no.458(R), no.459(EMD) |
Page |
pp.49-52 |
#Pages |
4 |
Date of Issue |
2017-02-10 (R, EMD) |
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