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Paper Abstract and Keywords
Presentation 2017-03-03 15:00
A Small and Coverless T/R Module with Electromagnetic Shielded Surface Mount Packages
Hiroyuki Mizutani, Hidenori Ishibashi, Masatake Hangai, Takanobu Fujiwara, Kenichi Tajima (Mitsubishi Electric) MW2016-214 ICD2016-144
Abstract (in Japanese) (See Japanese page) 
(in English) Small size and high performance electronic devices are required lately. To prevent a malfunction by an electromagnetic interference among the electronic parts mounted with high density on the electronic devices, development of small electromagnetic shielded parts are desired instead of those with the conventional structure with a metal shield cover. We proposed the new semiconductor packages with electromagnetic shield by metalizing on the surface of the QFN (Quad Flat Nolead) packages, and demonstrated the effectiveness of them. We name them “shielded QFN packages”. In this paper, we report the fabrication results of an X-band Transmitter/Receiver (T/R) module with shielded QFN packages for APAA(Active Phased Array Antenna). This module suppresses the radiation of the electromagnetic waves from the semiconductor packages. The radiation from the signal line of the printed circuit board is suppressed by using tri-plate transmission line in which the central conductor is sandwiched between ground planes. The developed module has enough small size of 13mm×72mm to be arrayed at intervals of the X-band antenna element. It has 3W of output power and 5.6dB of NF.
Keyword (in Japanese) (See Japanese page) 
(in English) Module / Shield / EMI / Coverless / QFN / / /  
Reference Info. IEICE Tech. Rep., vol. 116, no. 486, MW2016-214, pp. 141-144, March 2017.
Paper # MW2016-214 
Date of Issue 2017-02-23 (MW, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2016-214 ICD2016-144

Conference Information
Committee MW ICD  
Conference Date 2017-03-02 - 2017-03-03 
Place (in Japanese) (See Japanese page) 
Place (in English) Okayama Prefectural Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave Integrated Circuit / Microwave Technologies 
Paper Information
Registration To MW 
Conference Code 2017-03-MW-ICD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Small and Coverless T/R Module with Electromagnetic Shielded Surface Mount Packages 
Sub Title (in English)  
Keyword(1) Module  
Keyword(2) Shield  
Keyword(3) EMI  
Keyword(4) Coverless  
Keyword(5) QFN  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hiroyuki Mizutani  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
2nd Author's Name Hidenori Ishibashi  
2nd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
3rd Author's Name Masatake Hangai  
3rd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
4th Author's Name Takanobu Fujiwara  
4th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
5th Author's Name Kenichi Tajima  
5th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric)
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Speaker Author-1 
Date Time 2017-03-03 15:00:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # MW2016-214, ICD2016-144 
Volume (vol) vol.116 
Number (no) no.486(MW), no.487(ICD) 
Page pp.141-144 
#Pages 4 
Date of Issue 2017-02-23 (MW, ICD) 

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