Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-04-21 10:00
Plasma fusion CMP® technology for GaN substrates -- Evaluation of processing characteristics for plasma fusion CMP® using Ar plasma and ethanol bubbling --
Naoki Yamazaki (Kyushu Univ./Namiki PrecisionJewel Co.,LTD), Toshiro Doi (Kyushu Univ), Hideo Aida (Kyushu Univ./Namiki PrecisionJewel Co.,LTD), Seongwoo Kim, Koki Oyama (Namiki PrecisionJewel Co.,LTD), Shuhei Kurokawa (Kyushu Univ), Yasuhisa Sano (Osaka Univ.), Masaharu Shiratani, Yoko Yamanishi (Kyushu Univ) SDM2017-5 OME2017-5
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
Keyword (in Japanese) (See Japanese page) 
(in English) / / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 8, OME2017-5, pp. 19-23, April 2017.
Paper # OME2017-5 
Date of Issue 2017-04-13 (SDM, OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2017-5 OME2017-5

Conference Information
Committee OME SDM  
Conference Date 2017-04-20 - 2017-04-21 
Place (in Japanese) (See Japanese page) 
Place (in English) Tatsugochou Shougaigakushuu Center 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Organic molecular devices, silicon device, biotechnology, thin film device, novel material, evaluation method, etc 
Paper Information
Registration To OME 
Conference Code 2017-04-OME-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Plasma fusion CMP® technology for GaN substrates 
Sub Title (in English) Evaluation of processing characteristics for plasma fusion CMP® using Ar plasma and ethanol bubbling 
Keyword(1)  
Keyword(2)  
Keyword(3)  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Naoki Yamazaki  
1st Author's Affiliation Kyushu University/Namiki PrecisionJewel Co.,LTD (Kyushu Univ./Namiki PrecisionJewel Co.,LTD)
2nd Author's Name Toshiro Doi  
2nd Author's Affiliation Kyushu University (Kyushu Univ)
3rd Author's Name Hideo Aida  
3rd Author's Affiliation Kyushu University/Namiki PrecisionJewel Co.,LTD (Kyushu Univ./Namiki PrecisionJewel Co.,LTD)
4th Author's Name Seongwoo Kim  
4th Author's Affiliation Namiki PrecisionJewel Co.,LTD (Namiki PrecisionJewel Co.,LTD)
5th Author's Name Koki Oyama  
5th Author's Affiliation Namiki PrecisionJewel Co.,LTD (Namiki PrecisionJewel Co.,LTD)
6th Author's Name Shuhei Kurokawa  
6th Author's Affiliation Kyushu University (Kyushu Univ)
7th Author's Name Yasuhisa Sano  
7th Author's Affiliation Osaka University (Osaka Univ.)
8th Author's Name Masaharu Shiratani  
8th Author's Affiliation Kyushu University (Kyushu Univ)
9th Author's Name Yoko Yamanishi  
9th Author's Affiliation Kyushu University (Kyushu Univ)
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2017-04-21 10:00:00 
Presentation Time 25 minutes 
Registration for OME 
Paper # SDM2017-5, OME2017-5 
Volume (vol) vol.117 
Number (no) no.7(SDM), no.8(OME) 
Page pp.19-23 
#Pages
Date of Issue 2017-04-13 (SDM, OME) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan