| Paper Abstract and Keywords |
| Presentation |
2017-05-25 13:30
Realization of high frequency LLC resonant converter with GaN device Takehiro Shimizu (Shindengen), Yoshiaki Matsuda (STES), Yousuke Inoue (Shindengen Kumamoto) EE2017-2 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
Recently, the miniaturization and thinning of equipment has advanced, demand for miniaturization of the power supply to be mounted has become stronger. In order to miniaturize the power supply, the switching frequency should be increased to the high frequency, but depending on the characteristics of the parts used so far, making it difficult to increase the frequency. However, the diffusion of SiC and GaN called next-generation semiconductor devices and the diffusion of circuit topology with the evolution, the possibility of high frequency (MHz) switching has come to be seen.
This paper shows the contents of considering various possible problems concerning high frequency power supply. Also, the evaluation results of the prototype power supply based on the contents of consideration are reported. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
LLC resonant converter / high frequency / miniaturization / GaN device / / / / |
| Reference Info. |
IEICE Tech. Rep., vol. 117, no. 53, EE2017-2, pp. 7-11, May 2017. |
| Paper # |
EE2017-2 |
| Date of Issue |
2017-05-18 (EE) |
| ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
| Download PDF |
EE2017-2 |
| Conference Information |
| Committee |
EE IEE-HCA |
| Conference Date |
2017-05-25 - 2017-05-26 |
| Place (in Japanese) |
(See Japanese page) |
| Place (in English) |
The Kikai Shinko Kaikan building |
| Topics (in Japanese) |
(See Japanese page) |
| Topics (in English) |
|
| Paper Information |
| Registration To |
EE |
| Conference Code |
2017-05-EE-HCA |
| Language |
Japanese |
| Title (in Japanese) |
(See Japanese page) |
| Sub Title (in Japanese) |
(See Japanese page) |
| Title (in English) |
Realization of high frequency LLC resonant converter with GaN device |
| Sub Title (in English) |
|
| Keyword(1) |
LLC resonant converter |
| Keyword(2) |
high frequency |
| Keyword(3) |
miniaturization |
| Keyword(4) |
GaN device |
| Keyword(5) |
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| Keyword(6) |
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| 1st Author's Name |
Takehiro Shimizu |
| 1st Author's Affiliation |
Shindengen Electric Manufacturing Co., Ltd. (Shindengen) |
| 2nd Author's Name |
Yoshiaki Matsuda |
| 2nd Author's Affiliation |
STES Co., Ltd. (STES) |
| 3rd Author's Name |
Yousuke Inoue |
| 3rd Author's Affiliation |
Shindengen Kumamoto Techno-Research Co., Ltd. (Shindengen Kumamoto) |
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| Speaker |
Author-1 |
| Date Time |
2017-05-25 13:30:00 |
| Presentation Time |
30 minutes |
| Registration for |
EE |
| Paper # |
EE2017-2 |
| Volume (vol) |
vol.117 |
| Number (no) |
no.53 |
| Page |
pp.7-11 |
| #Pages |
5 |
| Date of Issue |
2017-05-18 (EE) |