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| Presentation | 2017-11-07 14:55 Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules Akihiro Tsukioka, Makoto Nagata, Kohki Taniguchi, Daisuke Fujimoto (Kobe Univ.), Rieko Akimoto, Takao Egami, Kenji Niinomi, Takeshi Yuhara, Sachio Hayashi (TOSHIBA), Rob Mathews, Karthik Srinivasan, Ying-Shiun Li, Norman Chang (ANSYS)  CPM2017-84 ICD2017-43 IE2017-69 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | In recent years, electromagnetic compatibility (EMC) becomes a major concern among IC chips. EMC is characterized in two directions. Electromagnetic emission (EMI) is the noise generated by the operation of the device. EMI cause noise to propagate through the power traces or air and interfere with other devices. Electromagnetic susceptibility (EMS) is the noise tolerance of IC chip. Direct power injection (DPI) method is standardized in IEC62132-4 for EMS testing. We designed the local interconnect network (LIN) test chip in a 0.13 nm BiCD process, and compared the simulated and measured attenuation of propagating noise of DPI test. The chip-package-system (CPS) board analysis including the extended chip power model (ECPM) predicts the RF noise coupling injected the EMS test. This results benefit ICs designers grasp the root cause of EMS. Keywords Electromagnetic susceptibility, Electromagnetic immunity, Substrate coupling, Power delivery network, Direct power injection, Extended chip power model, Local interconnect network |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Electromagnetic susceptibility / Electromagnetic immunity / Substrate coupling / Power delivery network / Direct power injection / Extended chip power model / Local interconnect network / | |
| Reference Info. | IEICE Tech. Rep., vol. 117, no. 276, ICD2017-43, pp. 27-32, Nov. 2017. | |
| Paper # | ICD2017-43 | |
| Date of Issue | 2017-10-30 (CPM, ICD, IE) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CPM2017-84 ICD2017-43 IE2017-69 |
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| Conference Information | |
| Committee | VLD DC CPSY RECONF CPM ICD IE IPSJ-SLDM |
| Conference Date | 2017-11-06 - 2017-11-08 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kumamoto-Kenminkouryukan Parea |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Design Gaia 2017 -New Field of VLSI Design- |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2017-11-VLD-DC-CPSY-RECONF-CPM-ICD-IE-SLDM-EMB-ARC |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules |
| Sub Title (in English) | |
| Keyword(1) | Electromagnetic susceptibility |
| Keyword(2) | Electromagnetic immunity |
| Keyword(3) | Substrate coupling |
| Keyword(4) | Power delivery network |
| Keyword(5) | Direct power injection |
| Keyword(6) | Extended chip power model |
| Keyword(7) | Local interconnect network |
| Keyword(8) | |
| 1st Author's Name | Akihiro Tsukioka |
| 1st Author's Affiliation | Kobe University (Kobe Univ.) |
| 2nd Author's Name | Makoto Nagata |
| 2nd Author's Affiliation | Kobe University (Kobe Univ.) |
| 3rd Author's Name | Kohki Taniguchi |
| 3rd Author's Affiliation | Kobe University (Kobe Univ.) |
| 4th Author's Name | Daisuke Fujimoto |
| 4th Author's Affiliation | Kobe University (Kobe Univ.) |
| 5th Author's Name | Rieko Akimoto |
| 5th Author's Affiliation | Toshiba Corporation (TOSHIBA) |
| 6th Author's Name | Takao Egami |
| 6th Author's Affiliation | Toshiba Corporation (TOSHIBA) |
| 7th Author's Name | Kenji Niinomi |
| 7th Author's Affiliation | Toshiba Corporation (TOSHIBA) |
| 8th Author's Name | Takeshi Yuhara |
| 8th Author's Affiliation | Toshiba Corporation (TOSHIBA) |
| 9th Author's Name | Sachio Hayashi |
| 9th Author's Affiliation | Toshiba Corporation (TOSHIBA) |
| 10th Author's Name | Rob Mathews |
| 10th Author's Affiliation | Semiconductor BU, ANSYS Inc. (ANSYS) |
| 11th Author's Name | Karthik Srinivasan |
| 11th Author's Affiliation | Semiconductor BU, ANSYS Inc. (ANSYS) |
| 12th Author's Name | Ying-Shiun Li |
| 12th Author's Affiliation | Semiconductor BU, ANSYS Inc. (ANSYS) |
| 13th Author's Name | Norman Chang |
| 13th Author's Affiliation | Semiconductor BU, ANSYS Inc. (ANSYS) |
| Speaker | Author-1 |
| Date Time | 2017-11-07 14:55:00 |
| Presentation Time | 25 minutes |
| Registration for | ICD |
| Paper # | CPM2017-84, ICD2017-43, IE2017-69 |
| Volume (vol) | vol.117 |
| Number (no) | no.275(CPM), no.276(ICD), no.277(IE) |
| Page | pp.27-32 |
| #Pages | 6 |
| Date of Issue | 2017-10-30 (CPM, ICD, IE) |
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