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Paper Abstract and Keywords
Presentation 2017-12-01 09:40
Pad-Conditioning/Slurry-Supply Hybrid Effect of High-Pressure-Micro-Jet (HPMJ) Method During CMP Process
Keiichi Tsukamoto, Toshiro Doi (Kyushu Univ.), Chengwu Wang (Zhejiang Normal Univ.), Kiyoshi Seshimo (Kyushu Univ.), Keiji Miyachi, Mikihiro Kato (Asahi Sunac Co.), Tadakazu Miyashita (Fujikoshi Machinery Co.), Masanori Ohtsubo, Yoko Matsunaga (Kyushu Univ.) OME2017-36
Abstract (in Japanese) (See Japanese page) 
(in English) Clogging of the polishing pad is inevitable during CMP process for semiconductor wafer. Conventional reconditioning method to remove the clogging of the pad is to grind off the pad surface using diamond electroplated conditioner, which can damage and thin the pad surface and shorten the life. Recently HPMJ (High Pressure Micro Jet) is adopted to the pad conditioning process, which can extremely reduce the pad damage. In this paper, novel polishing slurry feeding system using HPMJ apparatus is presented, implementing hybrid effect. New method feed the slurry and condition the pad simultaneously (i.e. in-situ conditioning). Long time polishing was executed for Si wafer and the result revealed this method show the stable high material removal rate (MRR) and low surface roughness for long duration of time compared to the conventional slurry dropping method. This HPMJ hybrid system can apply to the polishing process for hard-and-brittle semiconductor materials with wide bandgap such as SiC or GaN.
Keyword (in Japanese) (See Japanese page) 
(in English) semiconductor / CMP / HPMJ / pad conditioning / in-situ conditioning / slurry supply / Si wafer / SiC  
Reference Info. IEICE Tech. Rep., vol. 117, no. 334, OME2017-36, pp. 7-12, Dec. 2017.
Paper # OME2017-36 
Date of Issue 2017-11-24 (OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee OME  
Conference Date 2017-12-01 - 2017-12-01 
Place (in Japanese) (See Japanese page) 
Place (in English) Sun Messe Tosu 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Organic molecular devices, biotechnology, thin film, novel material, evaluation method, etc 
Paper Information
Registration To OME 
Conference Code 2017-12-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Pad-Conditioning/Slurry-Supply Hybrid Effect of High-Pressure-Micro-Jet (HPMJ) Method During CMP Process 
Sub Title (in English)  
Keyword(1) semiconductor  
Keyword(2) CMP  
Keyword(3) HPMJ  
Keyword(4) pad conditioning  
Keyword(5) in-situ conditioning  
Keyword(6) slurry supply  
Keyword(7) Si wafer  
Keyword(8) SiC  
1st Author's Name Keiichi Tsukamoto  
1st Author's Affiliation Global Innovation Center, Kyushu University (Kyushu Univ.)
2nd Author's Name Toshiro Doi  
2nd Author's Affiliation Global Innovation Center, Kyushu University (Kyushu Univ.)
3rd Author's Name Chengwu Wang  
3rd Author's Affiliation Zhejiang Normal University (Zhejiang Normal Univ.)
4th Author's Name Kiyoshi Seshimo  
4th Author's Affiliation Global Innovation Center, Kyushu University (Kyushu Univ.)
5th Author's Name Keiji Miyachi  
5th Author's Affiliation Asahi Sunac Corporation (Asahi Sunac Co.)
6th Author's Name Mikihiro Kato  
6th Author's Affiliation Asahi Sunac Corporation (Asahi Sunac Co.)
7th Author's Name Tadakazu Miyashita  
7th Author's Affiliation Fujikoshi Machinery Corporation (Fujikoshi Machinery Co.)
8th Author's Name Masanori Ohtsubo  
8th Author's Affiliation Global Innovation Center, Kyushu University (Kyushu Univ.)
9th Author's Name Yoko Matsunaga  
9th Author's Affiliation Global Innovation Center, Kyushu University (Kyushu Univ.)
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Speaker Author-1 
Date Time 2017-12-01 09:40:00 
Presentation Time 20 minutes 
Registration for OME 
Paper # OME2017-36 
Volume (vol) vol.117 
Number (no) no.334 
Page pp.7-12 
#Pages 6 
Date of Issue 2017-11-24 (OME) 

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