Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-12-01 13:10
Smart polishing by applying the limelight Dilatancy-Pad -- Evaluation for Dilatancy-Pad materials and SiC substrates's polishing characteristics --
Kiyoshi Seshimo, Tshiro Doi, Masanori Ohtsubo, Keiichi Tukamoto (Kyushu Univ.), Masataka Takagi (FUJIBO Ehime), Daizo Ichikawa (Fjikoshi Machinery) OME2017-42
Abstract (in Japanese) (See Japanese page) 
(in English) Dilatancy material has hold the key to construct Smart-polishing technology for hard-to-process material substrates such as Sapphire, SiC, and GaN. Regarding on the factors that determines the polishing characteristic, We have focused onto the index n > 1.0 in Ostwald's flow equation in order to develop the optimum dilatancy material for satisfy both between high polishing efficiency and high polishing surface quality. And therefore, a new property evaluation technique has been established by drop impact tests and further evaluated the Polishing characteristics of the prototype pad. As a result, Compared to the conventional technology, the material removal rates can be increased to 2.5 to 10 times, the surface roughness is 1/3rd, the number of scratches in the wafer: 1/100th, the depth of the latent damage layer is 1/10th, and high efficiency making it possible to put high-grade polishing into practical use.
Keyword (in Japanese) (See Japanese page) 
(in English) CMP / SiC / dilatancy phenomenon / Ostwald’s flow / ｄrop impact test / impact speed / material evaluation method / process- damage layer  
Reference Info. IEICE Tech. Rep., vol. 117, no. 334, OME2017-42, pp. 31-36, Dec. 2017.
Paper # OME2017-42 
Date of Issue 2017-11-24 (OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF OME2017-42

Conference Information
Committee OME  
Conference Date 2017-12-01 - 2017-12-01 
Place (in Japanese) (See Japanese page) 
Place (in English) Sun Messe Tosu 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Organic molecular devices, biotechnology, thin film, novel material, evaluation method, etc 
Paper Information
Registration To OME 
Conference Code 2017-12-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Smart polishing by applying the limelight Dilatancy-Pad 
Sub Title (in English) Evaluation for Dilatancy-Pad materials and SiC substrates's polishing characteristics 
Keyword(1) CMP  
Keyword(2) SiC  
Keyword(3) dilatancy phenomenon  
Keyword(4) Ostwald’s flow  
Keyword(5) ｄrop impact test  
Keyword(6) impact speed  
Keyword(7) material evaluation method  
Keyword(8) process- damage layer  
1st Author's Name Kiyoshi Seshimo  
1st Author's Affiliation Kyushu University (Kyushu Univ.)
2nd Author's Name Tshiro Doi  
2nd Author's Affiliation Kyushu University (Kyushu Univ.)
3rd Author's Name Masanori Ohtsubo  
3rd Author's Affiliation Kyushu University (Kyushu Univ.)
4th Author's Name Keiichi Tukamoto  
4th Author's Affiliation Kyushu University (Kyushu Univ.)
5th Author's Name Masataka Takagi  
5th Author's Affiliation FUJIBO Ehime Co.,Ltd. (FUJIBO Ehime)
6th Author's Name Daizo Ichikawa  
6th Author's Affiliation Fujikoshi Machinery Corp. (Fjikoshi Machinery)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2017-12-01 13:10:00 
Presentation Time 20 minutes 
Registration for OME 
Paper # OME2017-42 
Volume (vol) vol.117 
Number (no) no.334 
Page pp.31-36 
#Pages 6 
Date of Issue 2017-11-24 (OME) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan