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| Presentation | 2018-04-27 14:50 S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate Kengo Kawasaki, Eigo Kuwata, Hidenori Ishibashi, Tomohiro Yao, Kiyoshi Ishida, Kazuhiro Maeda, Hironobu Shibata, Masaomi Tsuru, Kazutomi Mori, Mitsuhiro Shimozawa, Hiroshi Fukumoto (Mitsubishi Electric Corp.)  WPT2018-5 MW2018-5 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | A SiGe chip and GaN chip packaged Tx module in S-band is represented. SiGe and GaN with Redistribution Layer (RDL) are integrated in 3D package. A chip embedding substrate is adopted and the GaN chip consisting of a power amplifier is embedded in the substrate. SiGe chip consisting a phase shifter and a variable gain amplifier is flip-chip bonded on the GaN chip embedded substrate. The package area of the Tx module is 7mm by 7mm. The measured RMS phase error rate of 1.3 degree and RMS amplitude error rate of 0.31dB are obtained in S-band, respectively. The maximum output power of 32dBm is achieved in S-band. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Package / Cu Pillar / Chip embedding substrate / MMIC / SiGe HBT / GaN HEMT / Tx module / | |
| Reference Info. | IEICE Tech. Rep., vol. 118, no. 18, MW2018-5, pp. 19-23, April 2018. | |
| Paper # | MW2018-5 | |
| Date of Issue | 2018-04-20 (WPT, MW) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | WPT2018-5 MW2018-5 |
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| Conference Information | |
| Committee | MW WPT |
| Conference Date | 2018-04-27 - 2018-04-27 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Building |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Wireless Power Transfer / microwave, general |
| Paper Information | |
| Registration To | MW |
| Conference Code | 2018-04-MW-WPT |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate |
| Sub Title (in English) | |
| Keyword(1) | Package |
| Keyword(2) | Cu Pillar |
| Keyword(3) | Chip embedding substrate |
| Keyword(4) | MMIC |
| Keyword(5) | SiGe HBT |
| Keyword(6) | GaN HEMT |
| Keyword(7) | Tx module |
| Keyword(8) | |
| 1st Author's Name | Kengo Kawasaki |
| 1st Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 2nd Author's Name | Eigo Kuwata |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 3rd Author's Name | Hidenori Ishibashi |
| 3rd Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 4th Author's Name | Tomohiro Yao |
| 4th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 5th Author's Name | Kiyoshi Ishida |
| 5th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 6th Author's Name | Kazuhiro Maeda |
| 6th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 7th Author's Name | Hironobu Shibata |
| 7th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 8th Author's Name | Masaomi Tsuru |
| 8th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 9th Author's Name | Kazutomi Mori |
| 9th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 10th Author's Name | Mitsuhiro Shimozawa |
| 10th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| 11th Author's Name | Hiroshi Fukumoto |
| 11th Author's Affiliation | Mitsubishi Electric Corporation (Mitsubishi Electric Corp.) |
| Speaker | Author-1 |
| Date Time | 2018-04-27 14:50:00 |
| Presentation Time | 25 minutes |
| Registration for | MW |
| Paper # | WPT2018-5, MW2018-5 |
| Volume (vol) | vol.118 |
| Number (no) | no.17(WPT), no.18(MW) |
| Page | pp.19-23 |
| #Pages | 5 |
| Date of Issue | 2018-04-20 (WPT, MW) |
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