Paper Abstract and Keywords |
Presentation |
2018-06-25 11:40
Control of SiO2/GaN Interface for High-performance GaN MOSFET Tauji Hosoi, Takahiro Yamada, Mikito Nozaki (Osaka Univ.), Tokio Takahashi, Hisashi Yamada, Mitsuaki Shimizu (AIST), Akitaka Yoshigoe (JAEA), Takayoshi Shimura, Heiji Watanabe (Osaka Univ.) SDM2018-18 Link to ES Tech. Rep. Archives: SDM2018-18 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
A high-quality gate insulator together with low interface states is indispensable for GaN-based power MOSFETs. We have recently reported low interface state density of GaOx/GaN structures formed by thermal oxidation or sputter deposition, while surface morphology of GaOx layer was concerned. In this work, plasma-enhanced CVD-deposition of SiO2 films on GaN surface forming GaOx interlayers was carried out. Although the fabricated SiO2/GaOx/GaN structures with post-deposition annealing exhibited low interface state densities, Ga diffusion into SiO2 layers severely degraded the insulating properties. We also demonstrated that the PDA based on rapid thermal processing is beneficial in suppressing Ga diffusion, leading to high-quality interface together with superior insulating property. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
GaN / SiO2 / MOS devices / interface / reliability / / / |
Reference Info. |
IEICE Tech. Rep., vol. 118, no. 110, SDM2018-18, pp. 11-14, June 2018. |
Paper # |
SDM2018-18 |
Date of Issue |
2018-06-18 (SDM) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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SDM2018-18 Link to ES Tech. Rep. Archives: SDM2018-18 |
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