Paper Abstract and Keywords |
Presentation |
2018-07-12 14:20
Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform Takeshi Matsumoto, Teruo Kurahashi (Fujitsu Lab), Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa (AIST), Ayahito Uetake, Kazumasa Takabayashi (Fujitsu Lab), Kazuhiro Ikeda, Hitoshi Kawashima (AIST), Suguru Akiyama, Shigeaki Sekiguchi (Fujitsu Lab) LQE2018-23 Link to ES Tech. Rep. Archives: LQE2018-23 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for optical loss compensation of large-scale Si optical switches which are key devices in optical pass networks. For efficient coupling and large alignment tolerance, we adopted width-tapered spot-size converters (SSCs) on SOAs. On Si optical platforms, we used SiON dual-core SSCs for the coupling to SOAs. We developed precise flip-chip bonding (FCB) technologies of SOAs on Si optical platforms within 1-um alignment accuracy, and achieved in-line optical amplification of 15 dB and loss-less operation of 4x4 Si optical switches with SOA. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Silicon Photonics / Hybrid Integration / Flip-Chip Bonding / Silicon Optical Switch / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 118, no. 129, LQE2018-23, pp. 13-16, July 2018. |
Paper # |
LQE2018-23 |
Date of Issue |
2018-07-05 (LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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LQE2018-23 Link to ES Tech. Rep. Archives: LQE2018-23 |