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Paper Abstract and Keywords
Presentation 2018-12-05 15:05
Horizontal Wireless Bus for Free-Form SiP
Junichiro Kadomoto, Hidetsugu Irie, Shuichi Sakai (The Univ. of Tokyo) VLD2018-46 DC2018-32
Abstract (in Japanese) (See Japanese page) 
(in English) We propose a wireless bus interface which connects chips integrated side by side wirelessly. Implementing large coils and transceiver circuits on each chip enables communication between multiple chips via horizontal inductive coupling. By using the proposed inter-chip communication technology and wireless power transmission technology in combination, wired connection between chips and between chips and a board is removed, and embedded systems with various shapes are realized.
Keyword (in Japanese) (See Japanese page) 
(in English) system-in-a-package (SiP) / inductive coupling / 3-D integration / / / / /  
Reference Info. IEICE Tech. Rep., vol. 118, no. 334, VLD2018-46, pp. 43-48, Dec. 2018.
Paper # VLD2018-46 
Date of Issue 2018-11-28 (VLD, DC) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2018-46 DC2018-32

Conference Information
Committee VLD DC CPSY RECONF CPM ICD IE IPSJ-SLDM 
Conference Date 2018-12-05 - 2018-12-07 
Place (in Japanese) (See Japanese page) 
Place (in English) Satellite Campus Hiroshima 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Design Gaia 2018 -New Field of VLSI Design- 
Paper Information
Registration To VLD 
Conference Code 2018-12-VLD-DC-CPSY-RECONF-CPM-ICD-IE-SLDM-EMB-ARC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Horizontal Wireless Bus for Free-Form SiP 
Sub Title (in English)  
Keyword(1) system-in-a-package (SiP)  
Keyword(2) inductive coupling  
Keyword(3) 3-D integration  
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1st Author's Name Junichiro Kadomoto  
1st Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
2nd Author's Name Hidetsugu Irie  
2nd Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
3rd Author's Name Shuichi Sakai  
3rd Author's Affiliation The University of Tokyo (The Univ. of Tokyo)
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Speaker Author-1 
Date Time 2018-12-05 15:05:00 
Presentation Time 25 minutes 
Registration for VLD 
Paper # VLD2018-46, DC2018-32 
Volume (vol) vol.118 
Number (no) no.334(VLD), no.335(DC) 
Page pp.43-48 
#Pages 6 
Date of Issue 2018-11-28 (VLD, DC) 

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