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| Presentation | 2020-02-07 11:20 [Invited Talk] Novel Volatile Film for Precise Dual Damascene Fabrication Makoto Fujikawa, Tatsuya Yamaguchi (TTS), Yuki Kikuchi, Kaoru Maekawa (TTCA), Hiroaki Kawasaki, Yoji Iizuka (TEL)  SDM2019-92 Link to ES Tech. Rep. Archives: SDM2019-92 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Abstract— Plasma induced damage on porous low-k dielectrics is a critical issue to lower the interconnect RC delay in the latest and upcoming highly dense integrated circuits. In order to reduce the exposure the low-k material to plasma, a novel volatile material, which can be removed simply by thermal energy is developed [1]-[7]. Utilizing this film as temporary sealing plug, it can protect the low-k dielectrics from being exposed to plasma during upcoming ashing processes, and furthermore. It can be removed easily without additional damage. In this paper, we demonstrate the effect of the volatile material by examining its filling property, electrical characteristics and reliability on the test pattern. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Volatile material / Thermal removal / Plug material / Porous low-k material / Plasma damage / Ashing / / | |
| Reference Info. | IEICE Tech. Rep., vol. 119, no. 410, SDM2019-92, pp. 21-23, Feb. 2020. | |
| Paper # | SDM2019-92 | |
| Date of Issue | 2020-01-31 (SDM) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | SDM2019-92 Link to ES Tech. Rep. Archives: SDM2019-92 |
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| Conference Information | |
| Committee | SDM |
| Conference Date | 2020-02-07 - 2020-02-07 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Tokyo University-Hongo |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | SDM |
| Conference Code | 2020-02-SDM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Novel Volatile Film for Precise Dual Damascene Fabrication |
| Sub Title (in English) | |
| Keyword(1) | Volatile material |
| Keyword(2) | Thermal removal |
| Keyword(3) | Plug material |
| Keyword(4) | Porous low-k material |
| Keyword(5) | Plasma damage |
| Keyword(6) | Ashing |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Makoto Fujikawa |
| 1st Author's Affiliation | Tokyo Electron Technology Solutions Inc. (TTS) |
| 2nd Author's Name | Tatsuya Yamaguchi |
| 2nd Author's Affiliation | Tokyo Electron Technology Solutions Inc. (TTS) |
| 3rd Author's Name | Yuki Kikuchi |
| 3rd Author's Affiliation | TEL Technology Center America LLC (TTCA) |
| 4th Author's Name | Kaoru Maekawa |
| 4th Author's Affiliation | TEL Technology Center America LLC (TTCA) |
| 5th Author's Name | Hiroaki Kawasaki |
| 5th Author's Affiliation | Tokyo Electron Limited (TEL) |
| 6th Author's Name | Yoji Iizuka |
| 6th Author's Affiliation | Tokyo Electron Limited (TEL) |
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| Speaker | Author-6 |
| Date Time | 2020-02-07 11:20:00 |
| Presentation Time | 35 minutes |
| Registration for | SDM |
| Paper # | SDM2019-92 |
| Volume (vol) | vol.119 |
| Number (no) | no.410 |
| Page | pp.21-23 |
| #Pages | 3 |
| Date of Issue | 2020-01-31 (SDM) |
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