Paper Abstract and Keywords |
Presentation |
2020-12-11 10:45
Introduction of Power DEM (Device Embedded Module) technology & CSIPOS Shigehiro Hayashi, Haruki Sueyoshi, Kanta Nogita (Fukuoka IST), Younggun HAN, Yoshihisa Katoh (CSIPOS), Tadashi Suetsugu (ukuoka Univ.) EE2020-16 CPM2020-48 OME2020-1 Link to ES Tech. Rep. Archives: CPM2020-48 OME2020-1 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
(Not available yet) |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Embedded substrate / Power module / Power device / Printed circuit board / Cu electroplating / / / |
Reference Info. |
IEICE Tech. Rep., vol. 120, no. 283, EE2020-16, pp. 1-6, Dec. 2020. |
Paper # |
EE2020-16 |
Date of Issue |
2020-12-04 (EE, CPM, OME) |
ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EE2020-16 CPM2020-48 OME2020-1 Link to ES Tech. Rep. Archives: CPM2020-48 OME2020-1 |
Conference Information |
Committee |
EE OME CPM |
Conference Date |
2020-12-11 - 2020-12-11 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Online |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
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Paper Information |
Registration To |
EE |
Conference Code |
2020-12-EE-OME-CPM |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Introduction of Power DEM (Device Embedded Module) technology & CSIPOS |
Sub Title (in English) |
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Keyword(1) |
Embedded substrate |
Keyword(2) |
Power module |
Keyword(3) |
Power device |
Keyword(4) |
Printed circuit board |
Keyword(5) |
Cu electroplating |
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1st Author's Name |
Shigehiro Hayashi |
1st Author's Affiliation |
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST) |
2nd Author's Name |
Haruki Sueyoshi |
2nd Author's Affiliation |
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST) |
3rd Author's Name |
Kanta Nogita |
3rd Author's Affiliation |
Fukuoka Industry, Science & Technology Foundation (Fukuoka IST) |
4th Author's Name |
Younggun HAN |
4th Author's Affiliation |
Center of System Integration Platform Organization Stan- dards, Fukuoka University (CSIPOS) |
5th Author's Name |
Yoshihisa Katoh |
5th Author's Affiliation |
Center of System Integration Platform Organization Stan- dards, Fukuoka University (CSIPOS) |
6th Author's Name |
Tadashi Suetsugu |
6th Author's Affiliation |
Department of Electronics Engineering and Computer Sci- ence, Fukuoka University (ukuoka Univ.) |
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Speaker |
Author-1 |
Date Time |
2020-12-11 10:45:00 |
Presentation Time |
25 minutes |
Registration for |
EE |
Paper # |
EE2020-16, CPM2020-48, OME2020-1 |
Volume (vol) |
vol.120 |
Number (no) |
no.283(EE), no.284(CPM), no.285(OME) |
Page |
pp.1-6 |
#Pages |
6 |
Date of Issue |
2020-12-04 (EE, CPM, OME) |
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