Paper Abstract and Keywords |
Presentation |
2021-01-29 13:00
DC Characteristics and MOS Interface properties of HfSiOx-gate AlGaN/GaN HEMTs Ryota Ochi (Hokkaido Univ.), Erika Maeda (SIT/NIMS), Toshihide Nabatame (NIMS), Koji Shiozaki (IMaSS), Tamotsu Hashizume (Hokkaido Univ/IMaSS) ED2020-31 MW2020-84 Link to ES Tech. Rep. Archives: ED2020-31 MW2020-84 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
GaN high-electron-mobility transistors (HEMTs) are very attractive for the fifth generation communication system. To build up a stable MIS gate structure, we have to consider basic properties of insulators such as bandgap, permittivity, breakdown field and chemical stability. HfSiOx has been applied to AlGaN/GaN high-electron-mobility transistors (HEMTs) as a high-$kappa$ gate dielectric. The HfSiOx-gate HEMT showed good transfer characteristics with a high transconductance expected from its $kappa$ value and a subthreshold swing of 71mV/dec. For the MOS HEMT diode, we observed excellent C-V characteristics with negligible frequency dispersion. The detailed C-V analysis showed low state densities on the order of $10^{11}cm^{-2}eV^{-1}$ at the HfSiOx/AlGaN interface. In addition, excellent operation stability of the MOS HEMT was observed at high temperatures up to 150$^circ$. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
AlGaN / GaN / MOS / HEMT / HfSiOx / Interface state / high-κ / |
Reference Info. |
IEICE Tech. Rep., vol. 120, no. 353, ED2020-31, pp. 22-25, Jan. 2021. |
Paper # |
ED2020-31 |
Date of Issue |
2021-01-22 (ED, MW) |
ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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ED2020-31 MW2020-84 Link to ES Tech. Rep. Archives: ED2020-31 MW2020-84 |
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