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Paper Abstract and Keywords
Presentation 2022-02-04 09:05
[Invited Talk] Quantitative evaluation on barrier property of ultra-thin PVD-Co(W) films using lag-time method
Takeshi Momose, Taewoong Kim, Yubin Deng, Momoko Deura (UTokyo), Akira Matsuo, Nobuo Yamaguchi (CANON ANELVA), Yukihiro Shimogaki (UTokyo) SDM2021-74
Abstract (in Japanese) (See Japanese page) 
(in English) For the development of ultra-thin barrier layers for Cu interconnections in ultra large scale integration, it is essential to have a quantitative and concise method to evaluate the barrier properties. For this purpose, we have developed a method to evaluate the diffusion coefficient of Cu in ultra-thin barrier layers by applying the time-lag method, which was originally developed to measure the diffusion coefficient of H2 in porous membranes. This method analyzes the trace amount of Cu passing through the barrier film in the stacked structure of Cu/barrier/underlayer after annealing. The diffusion coefficients of Cu in tungsten-containing cobalt thin films [Co(W)] were evaluated using this method, which are expected to work as a single liner/barrier because of their high adhesion to Cu, excellent Cu diffusion barrier properties, and low resistivity. The Co(W) films showed better barrier properties than the current TaN films. The quantitative evaluation of barrier properties by this method is expected to promote the development of barrier materials.
Keyword (in Japanese) (See Japanese page) 
(in English) Time-lag method / Barrier property / Copper / Cobalt / Tungsten / / /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 366, SDM2021-74, pp. 1-4, Feb. 2022.
Paper # SDM2021-74 
Date of Issue 2022-01-28 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2022-02-04 - 2022-02-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2022-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Quantitative evaluation on barrier property of ultra-thin PVD-Co(W) films using lag-time method 
Sub Title (in English)  
Keyword(1) Time-lag method  
Keyword(2) Barrier property  
Keyword(3) Copper  
Keyword(4) Cobalt  
Keyword(5) Tungsten  
Keyword(6)  
Keyword(7)  
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1st Author's Name Takeshi Momose  
1st Author's Affiliation The University of Tokyo (UTokyo)
2nd Author's Name Taewoong Kim  
2nd Author's Affiliation The University of Tokyo (UTokyo)
3rd Author's Name Yubin Deng  
3rd Author's Affiliation The University of Tokyo (UTokyo)
4th Author's Name Momoko Deura  
4th Author's Affiliation The University of Tokyo (UTokyo)
5th Author's Name Akira Matsuo  
5th Author's Affiliation CANON ANELVA CORPORATION (CANON ANELVA)
6th Author's Name Nobuo Yamaguchi  
6th Author's Affiliation CANON ANELVA CORPORATION (CANON ANELVA)
7th Author's Name Yukihiro Shimogaki  
7th Author's Affiliation The University of Tokyo (UTokyo)
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Speaker Author-1 
Date Time 2022-02-04 09:05:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2021-74 
Volume (vol) vol.121 
Number (no) no.366 
Page pp.1-4 
#Pages 4 
Date of Issue 2022-01-28 (SDM) 

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