Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2022-03-09 16:20
[Short Paper] Development of wiring work instruction system using HoloLens2
Keishi Nishimoto, Takeshi Hirama (itic) IMQ2021-25 IE2021-87 MVE2021-54
Abstract (in Japanese) (See Japanese page) 
(in English) The shortage of workers has become an issue at the manufacturing site, and one worker is increasingly in charge of multiple tasks. In particular, at the site of wiring work, it is often the case that employees who are unfamiliar with the work are entrusted with the wiring work, and quality deterioration due to wiring mistakes and work omissions due to misreading of the wiring diagram has become an issue.
Therefore, in this research, in order to suppress erroneous work, we have developed a prototype of a wiring work instruction system using HoloLens 2 that enables the operator to intuitively present the terminal position to be wired. ..
Keyword (in Japanese) (See Japanese page) 
(in English) HoloLens2 / Work support / Wiring work / AR marker / / / /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 423, MVE2021-54, pp. 82-83, March 2022.
Paper # MVE2021-54 
Date of Issue 2022-03-02 (IMQ, IE, MVE) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF IMQ2021-25 IE2021-87 MVE2021-54

Conference Information
Committee CQ IMQ MVE IE  
Conference Date 2022-03-09 - 2022-03-11 
Place (in Japanese) (See Japanese page) 
Place (in English) Online (Zoom) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Media of five senses, Multimedia, Media experience, Picture codinge, Image media quality, Network,quality and reliability, etc 
Paper Information
Registration To MVE 
Conference Code 2022-03-CQ-IMQ-MVE-IE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of wiring work instruction system using HoloLens2 
Sub Title (in English)  
Keyword(1) HoloLens2  
Keyword(2) Work support  
Keyword(3) Wiring work  
Keyword(4) AR marker  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Keishi Nishimoto  
1st Author's Affiliation Industrial Technology Center Of Ibaraki Prefecture (itic)
2nd Author's Name Takeshi Hirama  
2nd Author's Affiliation Industrial Technology Center Of Ibaraki Prefecture (itic)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2022-03-09 16:20:00 
Presentation Time 15 minutes 
Registration for MVE 
Paper # IMQ2021-25, IE2021-87, MVE2021-54 
Volume (vol) vol.121 
Number (no) no.420(IMQ), no.422(IE), no.423(MVE) 
Page pp.82-83 
#Pages 2 
Date of Issue 2022-03-02 (IMQ, IE, MVE) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan