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| Presentation | 2022-06-16 16:10 Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis Songxiang Wang, Kimiyoshi Usami (Shibaura IT)  CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | The problem of heat generation is more serious in 3D stacked chips than in non-stacked counterparts. In this study, we focus on 3D-LSIs which use a wireless communication technique called TCI (ThruChip Interface) and propose a thermal management method that reflects the characteristics of the structure. In particular, we focus on the factor of “ease of temperature rise” that varies depending on the position inside the 3D stacked chips, and developed a dynamic temperature control algorithm that incorporates this factor through temperature analysis by moving tasks. Simulation results demonstrated effectiveness of the proposed method. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | 3D-LSI / Dynamic Temperature Control / Task Migration / Thermal Management / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 122, no. 76, VLD2022-10, pp. 52-57, June 2022. | |
| Paper # | VLD2022-10 | |
| Date of Issue | 2022-06-09 (CAS, VLD, SIP, MSS) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10 |
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| Conference Information | |
| Committee | CAS SIP VLD MSS |
| Conference Date | 2022-06-16 - 2022-06-17 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Hachinohe Institute of Technology |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | VLD |
| Conference Code | 2022-06-CAS-SIP-VLD-MSS |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis |
| Sub Title (in English) | |
| Keyword(1) | 3D-LSI |
| Keyword(2) | Dynamic Temperature Control |
| Keyword(3) | Task Migration |
| Keyword(4) | Thermal Management |
| Keyword(5) | |
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| Keyword(8) | |
| 1st Author's Name | Songxiang Wang |
| 1st Author's Affiliation | Shibaura Institute of Technology (Shibaura IT) |
| 2nd Author's Name | Kimiyoshi Usami |
| 2nd Author's Affiliation | Shibaura Institute of Technology (Shibaura IT) |
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| Speaker | Author-1 |
| Date Time | 2022-06-16 16:10:00 |
| Presentation Time | 25 minutes |
| Registration for | VLD |
| Paper # | CAS2022-10, VLD2022-10, SIP2022-41, MSS2022-10 |
| Volume (vol) | vol.122 |
| Number (no) | no.75(CAS), no.76(VLD), no.77(SIP), no.78(MSS) |
| Page | pp.52-57 |
| #Pages | 6 |
| Date of Issue | 2022-06-09 (CAS, VLD, SIP, MSS) |
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