Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2022-07-19 14:50
Issues and Considerations for Improvement of Verification in ECDSA Attestation of Intel SGX
Yagawa Takashi (Tsukuba Univ.), Suzaki Kuniyasu, Teruya Tadanori, Ohara Kazuma (AIST), Abe Hirotake (Tsukuba Univ.) ISEC2022-11 SITE2022-15 BioX2022-36 HWS2022-11 ICSS2022-19 EMM2022-19
Abstract (in Japanese) (See Japanese page) 
(in English) Intel SGX is a kind of TEE (Trusted Execution Environment) and can protect the confidentiality and integrity of programs and data in the memory of SGX from attacks involving privileged instructions from the OS, hypervisor, etc. SGX offers Remote Attestation (RA), which confirms the authenticity of the genuine platform and intended software on SGX (i.e., TA: Trusted Application).In recent years, SGX is utilized for the clouds, SGX RA is also developed for Cloud in 2018; the Elliptic Curve Digital Signature Algorithm (ECDSA) Attestation, which is intended for use in data centers. However, the degree of freedom of implementation is higher than in the past, and it is unclear who guarantees the verification results. This paper describes the provisioning and execution of the current ECDSA Attestation and clarifies who guarantees the verified elements. Furthermore, from this, the challenges of ECDSA Attestation will be identified, and then measures for improvement will be discussed.
Keyword (in Japanese) (See Japanese page) 
(in English) Remote Attestation / Intel SGX / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 122, no. 125, HWS2022-11, pp. 23-28, July 2022.
Paper # HWS2022-11 
Date of Issue 2022-07-12 (ISEC, SITE, BioX, HWS, ICSS, EMM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ISEC2022-11 SITE2022-15 BioX2022-36 HWS2022-11 ICSS2022-19 EMM2022-19

Conference Information
Committee EMM BioX ISEC SITE ICSS HWS IPSJ-CSEC IPSJ-SPT 
Conference Date 2022-07-19 - 2022-07-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To HWS 
Conference Code 2022-07-EMM-BioX-ISEC-SITE-ICSS-HWS-CSEC-SPT 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Issues and Considerations for Improvement of Verification in ECDSA Attestation of Intel SGX 
Sub Title (in English)  
Keyword(1) Remote Attestation  
Keyword(2) Intel SGX  
Keyword(3)  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yagawa Takashi  
1st Author's Affiliation University of Tsukuba (Tsukuba Univ.)
2nd Author's Name Suzaki Kuniyasu  
2nd Author's Affiliation National Instituteof Advanced Industrial Science and Technology (AIST)
3rd Author's Name Teruya Tadanori  
3rd Author's Affiliation National Instituteof Advanced Industrial Science and Technology (AIST)
4th Author's Name Ohara Kazuma  
4th Author's Affiliation National Instituteof Advanced Industrial Science and Technology (AIST)
5th Author's Name Abe Hirotake  
5th Author's Affiliation University of Tsukuba (Tsukuba Univ.)
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2022-07-19 14:50:00 
Presentation Time 25 minutes 
Registration for HWS 
Paper # ISEC2022-11, SITE2022-15, BioX2022-36, HWS2022-11, ICSS2022-19, EMM2022-19 
Volume (vol) vol.122 
Number (no) no.122(ISEC), no.123(SITE), no.124(BioX), no.125(HWS), no.126(ICSS), no.127(EMM) 
Page pp.23-28 
#Pages 6 
Date of Issue 2022-07-12 (ISEC, SITE, BioX, HWS, ICSS, EMM) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan