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Paper Abstract and Keywords
Presentation 2023-03-17 10:45
Wiped-Rate Estimation for Semiconductor Manufacturing Using DNN Based on 3D Body Tracking
Takehiro Nagata (Univ. of Tsukuba), Li-Wei Cheng (NCKU), Hidehiko Shishido (Univ. of Tsukuba), Hyejin Kim, Chanya Mahapun, Naoki Yoshii, Tsuyoshi Moriya (TEL), Itaru Kitahara (Univ. of Tsukuba) IMQ2022-67 IE2022-144 MVE2022-97
Abstract (in Japanese) (See Japanese page) 
(in English) This research presents a method to calculate the corresponding wiped rate from upper body wiping movements to determine the optimal wiping motion. Fifty sequential 3D body motion data were recorded while wiping particles on a quartz ring using an RGB-D camera. The number of particles on the surface of the quartz ring was determined by calculating the particle area under UV light to estimate the wiped rate. The captured 3D body motion data and the wiped rate were combined as a dataset for deep learning. Three types of deep learning models were used: standalone Long Short-Term Memory (LSTM), Autoencoder (NN)-LSTM, and Autoencoder (LSTM)-LSTM. The results were compared and evaluated for their learning rate and accuracy.
Keyword (in Japanese) (See Japanese page) 
(in English) LSTM / Autoencoder / RGB-D camera / Semiconductor Manufacturing / 3D Body Tracking / / /  
Reference Info. IEICE Tech. Rep., vol. 122, no. 440, MVE2022-97, pp. 235-240, March 2023.
Paper # MVE2022-97 
Date of Issue 2023-03-08 (IMQ, IE, MVE) 
ISSN Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF IMQ2022-67 IE2022-144 MVE2022-97

Conference Information
Committee IMQ IE MVE CQ  
Conference Date 2023-03-15 - 2023-03-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Okinawaken Seinenkaikan (Naha-shi) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Media of five senses, Multimedia, Media experience, Picture codinge, Image media quality, Network,quality and reliability, etc(AC) 
Paper Information
Registration To MVE 
Conference Code 2023-03-IMQ-IE-MVE-CQ 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Wiped-Rate Estimation for Semiconductor Manufacturing Using DNN Based on 3D Body Tracking 
Sub Title (in English)  
Keyword(1) LSTM  
Keyword(2) Autoencoder  
Keyword(3) RGB-D camera  
Keyword(4) Semiconductor Manufacturing  
Keyword(5) 3D Body Tracking  
1st Author's Name Takehiro Nagata  
1st Author's Affiliation University of Tsukuba (Univ. of Tsukuba)
2nd Author's Name Li-Wei Cheng  
2nd Author's Affiliation National Cheng Kung University (NCKU)
3rd Author's Name Hidehiko Shishido  
3rd Author's Affiliation University of Tsukuba (Univ. of Tsukuba)
4th Author's Name Hyejin Kim  
4th Author's Affiliation Tokyo Electron Limited (TEL)
5th Author's Name Chanya Mahapun  
5th Author's Affiliation Tokyo Electron Limited (TEL)
6th Author's Name Naoki Yoshii  
6th Author's Affiliation Tokyo Electron Limited (TEL)
7th Author's Name Tsuyoshi Moriya  
7th Author's Affiliation Tokyo Electron Limited (TEL)
8th Author's Name Itaru Kitahara  
8th Author's Affiliation University of Tsukuba (Univ. of Tsukuba)
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Speaker Author-1 
Date Time 2023-03-17 10:45:00 
Presentation Time 25 minutes 
Registration for MVE 
Paper # IMQ2022-67, IE2022-144, MVE2022-97 
Volume (vol) vol.122 
Number (no) no.437(IMQ), no.439(IE), no.440(MVE) 
Page pp.235-240 
Date of Issue 2023-03-08 (IMQ, IE, MVE) 

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