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| Presentation | 2023-03-17 10:45 Wiped-Rate Estimation for Semiconductor Manufacturing Using DNN Based on 3D Body Tracking Takehiro Nagata (Univ. of Tsukuba), Li-Wei Cheng (NCKU), Hidehiko Shishido (Univ. of Tsukuba), Hyejin Kim, Chanya Mahapun, Naoki Yoshii, Tsuyoshi Moriya (TEL), Itaru Kitahara (Univ. of Tsukuba)  IMQ2022-67 IE2022-144 MVE2022-97 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | This research presents a method to calculate the corresponding wiped rate from upper body wiping movements to determine the optimal wiping motion. Fifty sequential 3D body motion data were recorded while wiping particles on a quartz ring using an RGB-D camera. The number of particles on the surface of the quartz ring was determined by calculating the particle area under UV light to estimate the wiped rate. The captured 3D body motion data and the wiped rate were combined as a dataset for deep learning. Three types of deep learning models were used: standalone Long Short-Term Memory (LSTM), Autoencoder (NN)-LSTM, and Autoencoder (LSTM)-LSTM. The results were compared and evaluated for their learning rate and accuracy. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | LSTM / Autoencoder / RGB-D camera / Semiconductor Manufacturing / 3D Body Tracking / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 122, no. 440, MVE2022-97, pp. 235-240, March 2023. | |
| Paper # | MVE2022-97 | |
| Date of Issue | 2023-03-08 (IMQ, IE, MVE) | |
| ISSN | Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | IMQ2022-67 IE2022-144 MVE2022-97 |
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| Conference Information | |
| Committee | IMQ IE MVE CQ |
| Conference Date | 2023-03-15 - 2023-03-17 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Okinawaken Seinenkaikan (Naha-shi) |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Media of five senses, Multimedia, Media experience, Picture codinge, Image media quality, Network,quality and reliability, etc（AC） |
| Paper Information | |
| Registration To | MVE |
| Conference Code | 2023-03-IMQ-IE-MVE-CQ |
| Language | English |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Wiped-Rate Estimation for Semiconductor Manufacturing Using DNN Based on 3D Body Tracking |
| Sub Title (in English) | |
| Keyword(1) | LSTM |
| Keyword(2) | Autoencoder |
| Keyword(3) | RGB-D camera |
| Keyword(4) | Semiconductor Manufacturing |
| Keyword(5) | 3D Body Tracking |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Takehiro Nagata |
| 1st Author's Affiliation | University of Tsukuba (Univ. of Tsukuba) |
| 2nd Author's Name | Li-Wei Cheng |
| 2nd Author's Affiliation | National Cheng Kung University (NCKU) |
| 3rd Author's Name | Hidehiko Shishido |
| 3rd Author's Affiliation | University of Tsukuba (Univ. of Tsukuba) |
| 4th Author's Name | Hyejin Kim |
| 4th Author's Affiliation | Tokyo Electron Limited (TEL) |
| 5th Author's Name | Chanya Mahapun |
| 5th Author's Affiliation | Tokyo Electron Limited (TEL) |
| 6th Author's Name | Naoki Yoshii |
| 6th Author's Affiliation | Tokyo Electron Limited (TEL) |
| 7th Author's Name | Tsuyoshi Moriya |
| 7th Author's Affiliation | Tokyo Electron Limited (TEL) |
| 8th Author's Name | Itaru Kitahara |
| 8th Author's Affiliation | University of Tsukuba (Univ. of Tsukuba) |
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| Speaker | Author-1 |
| Date Time | 2023-03-17 10:45:00 |
| Presentation Time | 25 minutes |
| Registration for | MVE |
| Paper # | IMQ2022-67, IE2022-144, MVE2022-97 |
| Volume (vol) | vol.122 |
| Number (no) | no.437(IMQ), no.439(IE), no.440(MVE) |
| Page | pp.235-240 |
| #Pages | 6 |
| Date of Issue | 2023-03-08 (IMQ, IE, MVE) |
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