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Paper Abstract and Keywords
Presentation 2023-06-09 12:50
FDTD analysis using reverse engineering model of FR-4
Hayato Ide (NITNC), Taiki Kitazawa, Yuichi Hayashi (NAIST), Takashi Kasuga (NITNC) EMCJ2023-19
Abstract (in Japanese) (See Japanese page) 
(in English) The communication speed of USB and HDMI connectors for external electronic devices mounted on information equipment has increased. However, when the connector terminals interfere with each other in the actual usage environment, it is difficult to accurately grasp the contact state of the internal terminals. In this research, in order to perform SI and EMI analysis of actual models, 3D models of electronic devices are made by CT-Scan, and are incorporated them into electromagnetic analysis. In this report, a CT-scan image of a differential line model with sufficient actual measurement and analysis data is examined, and a method of incorporating it into the FDTD analysis is examined. Create a differential line model with CT-Scan and acquire stl data. After that, it was converted to raster data to be incorporated in FDTD analysis. Since the CT-Scan image contains distortion and noise, it is not possible to construct an analysis model due to the shift in the q direction when converting to raster data. In addition, the effects of substrate distortion, line thickness, line horizontality, and line edge unevenness on the analysis were investigated. The thickness of the line becomes a factor of mismatching of characteristic impedance and differential impedance. It was clarified that the unevenness of the horizontal and edge of the line affects the asymmetry of the substrate structure and increases the common mode component.
Keyword (in Japanese) (See Japanese page) 
(in English) CT-Scan / FR-4 substrate / FDTD metod / mixed-mode S-parameters / / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 72, EMCJ2023-19, pp. 36-41, June 2023.
Paper # EMCJ2023-19 
Date of Issue 2023-06-02 (EMCJ) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2023-19

Conference Information
Committee EMCJ  
Conference Date 2023-06-09 - 2023-06-09 
Place (in Japanese) (See Japanese page) 
Place (in English) Otaru Chamber of Commerce & Industry 
Topics (in Japanese) (See Japanese page) 
Topics (in English) EMC 
Paper Information
Registration To EMCJ 
Conference Code 2023-06-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) FDTD analysis using reverse engineering model of FR-4 
Sub Title (in English)  
Keyword(1) CT-Scan  
Keyword(2) FR-4 substrate  
Keyword(3) FDTD metod  
Keyword(4) mixed-mode S-parameters  
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Keyword(6)  
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1st Author's Name Hayato Ide  
1st Author's Affiliation National Institute of Technology, Nagano College (NITNC)
2nd Author's Name Taiki Kitazawa  
2nd Author's Affiliation Nara Institute of Science and Technology (NAIST)
3rd Author's Name Yuichi Hayashi  
3rd Author's Affiliation Nara Institute of Science and Technology (NAIST)
4th Author's Name Takashi Kasuga  
4th Author's Affiliation National Institute of Technology, Nagano College (NITNC)
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Speaker Author-1 
Date Time 2023-06-09 12:50:00 
Presentation Time 20 minutes 
Registration for EMCJ 
Paper # EMCJ2023-19 
Volume (vol) vol.123 
Number (no) no.72 
Page pp.36-41 
#Pages 6 
Date of Issue 2023-06-02 (EMCJ) 

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