Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2023-08-01 11:10
Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature
Misato Taguchi, Ryozo Takahashi (Kobe Univ.), Masako Kato, Nobuhiro Kusuno (Hitachi, Ltd), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2023-37 ICD2023-16
Abstract (in Japanese) (See Japanese page) 
(in English) Quantum Computers are the most promising technologies to archive more complex calculations. At the same time, much large-number qubits are required to surpasses the performance of classical supercomputers. This paper presents the packaging structure by flip-chip stacking qubit chip on a silicon interposer, which has also interface chips or circuits, for large-scale quantum computer, and the conduction characteristics and cross-sectional structure of flip-chip silicon interposer which was cooled to cryogenic temperature (20 mK ~ 100 mK). Interface chip and silicon interposer were manufactured in 180 nm CMOS process in this work. The interposer was cooled to cryogenic temperature, and we confirmed the conduction via flip-chip stacked interface chip.
Keyword (in Japanese) (See Japanese page) 
(in English) Quantum Computer / Flip-Chip Packaging / Silicon Interposer / / / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 144, ICD2023-16, pp. 10-13, Aug. 2023.
Paper # ICD2023-16 
Date of Issue 2023-07-25 (SDM, ICD) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2023-37 ICD2023-16

Conference Information
Committee SDM ICD ITE-IST  
Conference Date 2023-08-01 - 2023-08-03 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokkaido Univ. Multimedia Education Bldg. 3F 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Analog, Mixed Analog and Digital, RF, and Sensor Interface, Low Voltage/Low Power Techniques, Novel Devices/Circuits, and the Applications 
Paper Information
Registration To ICD 
Conference Code 2023-08-SDM-ICD-IST 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature 
Sub Title (in English)  
Keyword(1) Quantum Computer  
Keyword(2) Flip-Chip Packaging  
Keyword(3) Silicon Interposer  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Misato Taguchi  
1st Author's Affiliation Kobe University (Kobe Univ.)
2nd Author's Name Ryozo Takahashi  
2nd Author's Affiliation Kobe University (Kobe Univ.)
3rd Author's Name Masako Kato  
3rd Author's Affiliation Hitachi, Ltd (Hitachi, Ltd)
4th Author's Name Nobuhiro Kusuno  
4th Author's Affiliation Hitachi, Ltd (Hitachi, Ltd)
5th Author's Name Takuji Miki  
5th Author's Affiliation Kobe University (Kobe Univ.)
6th Author's Name Makoto Nagata  
6th Author's Affiliation Kobe University (Kobe Univ.)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2023-08-01 11:10:00 
Presentation Time 25 minutes 
Registration for ICD 
Paper # SDM2023-37, ICD2023-16 
Volume (vol) vol.123 
Number (no) no.143(SDM), no.144(ICD) 
Page pp.10-13 
#Pages 4 
Date of Issue 2023-07-25 (SDM, ICD) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan