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Paper Abstract and Keywords
Presentation 2023-08-25 10:00
[Invited Talk] Status and Prospects of the Integrated Photonics Ecosystem
Tsuyoshi Horikawa (Tokyo Tech) R2023-29 EMD2023-24 CPM2023-34 OPE2023-73 LQE2023-20
Abstract (in Japanese) (See Japanese page) 
(in English) The current status and future evolution of the business ecosystem that supports the development of integrated photonics based on silicon photonics technology. There are many FEOL/BEOL foundries with various technologies in the ecosystem that supports the manufacturing and development of integrated photonics chips, and as a result, it is possible for each to build an appropriate supply chain for each application.
For broadband optical transceiver chips, which are the mainstream of integrated photonics applications, co-packaging with LSI and monolithic integration of light-emitting element functions, so called III/V on Si are being developed. The implementation of these functions will complicate the supply chain. It is thus important to build a function to design and verify the entire process according to the implementation of new functions.
Keyword (in Japanese) (See Japanese page) 
(in English) integrated photonics / silicon photonics / ecosystem / co-packaging / III-V on Si / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 162, LQE2023-20, pp. 63-66, Aug. 2023.
Paper # LQE2023-20 
Date of Issue 2023-08-17 (R, EMD, CPM, OPE, LQE) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2023-29 EMD2023-24 CPM2023-34 OPE2023-73 LQE2023-20

Conference Information
Committee LQE OPE CPM EMD R  
Conference Date 2023-08-24 - 2023-08-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku university 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Photodetectors, Modulators, Optical Electrical device packaging and reliability 
Paper Information
Registration To LQE 
Conference Code 2023-08-LQE-OPE-CPM-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Status and Prospects of the Integrated Photonics Ecosystem 
Sub Title (in English)  
Keyword(1) integrated photonics  
Keyword(2) silicon photonics  
Keyword(3) ecosystem  
Keyword(4) co-packaging  
Keyword(5) III-V on Si  
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1st Author's Name Tsuyoshi Horikawa  
1st Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
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Speaker Author-1 
Date Time 2023-08-25 10:00:00 
Presentation Time 10 minutes 
Registration for LQE 
Paper # R2023-29, EMD2023-24, CPM2023-34, OPE2023-73, LQE2023-20 
Volume (vol) vol.123 
Number (no) no.158(R), no.159(EMD), no.160(CPM), no.161(OPE), no.162(LQE) 
Page pp.63-66 
#Pages 4 
Date of Issue 2023-08-17 (R, EMD, CPM, OPE, LQE) 

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