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Paper Abstract and Keywords
Presentation 2023-08-25 09:50
[Invited Talk] Progress and Future Prospect of Photonic Integrated Devices using InP Chip/SOI Wafer Bonding Technique
Hideki Yagi (PETRA), Nobuhiko Nishiyama (Tokyo Tech), Naoki Fujiwara, Masaki Yanagisawa (PETRA) R2023-28 EMD2023-23 CPM2023-33 OPE2023-72 LQE2023-19
Abstract (in Japanese) (See Japanese page) 
(in English) The development of beyond fifth-generation (5G) and sixth-generation (6G) mobile communication systems is accelerating the increase of data traffic, and it is anticipated that a data rate of more than 10 Tbps will be required in one transceiver by 2030. On the other hand, conventional single-material photonic devices supporting optical communication systems seem to have limitations to achieve both high-speed operation and low power dissipation towards 10 Tbps-class data transmission. To overcome this technical challenge, heterogeneous integration which combines the advantages of III-V compound semiconductors and silicon photonics is expected as one of promising approaches. This paper discusses about the progress and future prospect of photonic integrated devices using InP chip/SOI wafer bonding technique.
Keyword (in Japanese) (See Japanese page) 
(in English) Heterogeneous integration / Chip-on-wafer direct bonding / InP / Silicon photonics / Wavelength tunable lasers / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 162, LQE2023-19, pp. 59-62, Aug. 2023.
Paper # LQE2023-19 
Date of Issue 2023-08-17 (R, EMD, CPM, OPE, LQE) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2023-28 EMD2023-23 CPM2023-33 OPE2023-72 LQE2023-19

Conference Information
Committee LQE OPE CPM EMD R  
Conference Date 2023-08-24 - 2023-08-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku university 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Photodetectors, Modulators, Optical Electrical device packaging and reliability 
Paper Information
Registration To LQE 
Conference Code 2023-08-LQE-OPE-CPM-EMD-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Progress and Future Prospect of Photonic Integrated Devices using InP Chip/SOI Wafer Bonding Technique 
Sub Title (in English)  
Keyword(1) Heterogeneous integration  
Keyword(2) Chip-on-wafer direct bonding  
Keyword(3) InP  
Keyword(4) Silicon photonics  
Keyword(5) Wavelength tunable lasers  
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1st Author's Name Hideki Yagi  
1st Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
2nd Author's Name Nobuhiko Nishiyama  
2nd Author's Affiliation Tokyo Institute of Technology (Tokyo Tech)
3rd Author's Name Naoki Fujiwara  
3rd Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
4th Author's Name Masaki Yanagisawa  
4th Author's Affiliation Photonics Electronics Technology Research Association (PETRA)
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Speaker Author-1 
Date Time 2023-08-25 09:50:00 
Presentation Time 10 minutes 
Registration for LQE 
Paper # R2023-28, EMD2023-23, CPM2023-33, OPE2023-72, LQE2023-19 
Volume (vol) vol.123 
Number (no) no.158(R), no.159(EMD), no.160(CPM), no.161(OPE), no.162(LQE) 
Page pp.59-62 
#Pages 4 
Date of Issue 2023-08-17 (R, EMD, CPM, OPE, LQE) 

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