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Paper Abstract and Keywords
Presentation 2023-11-16 17:10
Proposed power supply layout for RF circuits with a power panel containing MOM capacitors, bias control lines, and electrostatic protection diodes
Shunto Nishiura, Satoshi Tanaka, Takeshi Yoshida, Minoru Fujishima (Hiroshima Univ.) VLD2023-58 ICD2023-66 DC2023-65 RECONF2023-61
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, research has been conducted to develop a communication device that can achieve high data rates of 100 Gb/s or higher using the 300 GHz band, known as the Sub-THZ band, toward the realization of 6th generation mobile communications (6G). This research focuses on the structure for supplying power to circuits in the 300-GHz band. Specifically, a 10-μm square power panel that can be connected vertically and horizontally to effectively route power and ground supplied from the pads close to the circuit was considered, with the aim of achieving efficient power supply. The power panel design incorporates metal-oxide-metal (MOM) capacitors to provide large capacitance in a small space and efficiently add the bypass capacitance needed for the power supply lines to the RF circuits. In addition, control lines for supplying bias to the RF circuits are arranged on the matrix to allow bias to be supplied from the PAD to any location in contact with the panel. Furthermore, when connecting the gate bias of the transistor to each circuit, a diode is also connected to reduce plasma damage caused by the antenna effect in the wiring layer. The proposed power supply panel is expected to contribute widely to the design technology of high-frequency RFICs such as 6G.
Keyword (in Japanese) (See Japanese page) 
(in English) RFIC / Sub-THz / Power wiring / Power panel / / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 259, ICD2023-66, pp. 146-149, Nov. 2023.
Paper # ICD2023-66 
Date of Issue 2023-11-08 (VLD, ICD, DC, RECONF) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF VLD2023-58 ICD2023-66 DC2023-65 RECONF2023-61

Conference Information
Committee VLD DC RECONF ICD IPSJ-SLDM  
Conference Date 2023-11-15 - 2023-11-17 
Place (in Japanese) (See Japanese page) 
Place (in English) Civic Auditorium Sears Home Yume Hall 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Design Gaia 2023 -New Field of VLSI Design- 
Paper Information
Registration To ICD 
Conference Code 2023-11-VLD-DC-RECONF-ICD-SLDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Proposed power supply layout for RF circuits with a power panel containing MOM capacitors, bias control lines, and electrostatic protection diodes 
Sub Title (in English)  
Keyword(1) RFIC  
Keyword(2) Sub-THz  
Keyword(3) Power wiring  
Keyword(4) Power panel  
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1st Author's Name Shunto Nishiura  
1st Author's Affiliation Hiroshima University (Hiroshima Univ.)
2nd Author's Name Satoshi Tanaka  
2nd Author's Affiliation Hiroshima University (Hiroshima Univ.)
3rd Author's Name Takeshi Yoshida  
3rd Author's Affiliation Hiroshima University (Hiroshima Univ.)
4th Author's Name Minoru Fujishima  
4th Author's Affiliation Hiroshima University (Hiroshima Univ.)
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Speaker Author-1 
Date Time 2023-11-16 17:10:00 
Presentation Time 25 minutes 
Registration for ICD 
Paper # VLD2023-58, ICD2023-66, DC2023-65, RECONF2023-61 
Volume (vol) vol.123 
Number (no) no.258(VLD), no.259(ICD), no.260(DC), no.261(RECONF) 
Page pp.146-149 
#Pages 4 
Date of Issue 2023-11-08 (VLD, ICD, DC, RECONF) 

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