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Paper Abstract and Keywords
Presentation 2024-02-21 15:50
[Invited Talk] Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding
Yoshihisa Kagawa, Yukako Ikegami, Takahiro Kamei, Hayato Iwamoto (SSS) SDM2023-87
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, a variety of 3D stacked devices have been proposed. The Cu-Cu hybrid bonding that can realize high density electrical connections is key technology in both cases of homogeneous chip stacking and heterogeneous chip stacking. This paper summarizes our recent studies of WoW (wafer-on-wafer)/CoW (chip-on-wafer) hybrid bonding. Firstly, the concept and electrical properties of Cu-Cu wiring that is novel structure of Cu-Cu hybrid bonding will be introduced. Secondary, the three-wafer stacked module with face-to-face and
face-to-back hybrid bonding will be proposed. Finally, 400mm2-large chip on wafer bonding process and its electrical properties will be discussed.
Keyword (in Japanese) (See Japanese page) 
(in English) Cu-Cu hybrid bonding / Cu-Cu wiring / TSV / 3-wafer stacking / CoW / WoW / D2W /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 385, SDM2023-87, pp. 31-35, Feb. 2024.
Paper # SDM2023-87 
Date of Issue 2024-02-14 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2024-02-21 - 2024-02-21 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo University-Hongo-Engineering Bldg.4 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2024-02-SDM 
Language English 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding 
Sub Title (in English)  
Keyword(1) Cu-Cu hybrid bonding  
Keyword(2) Cu-Cu wiring  
Keyword(3) TSV  
Keyword(4) 3-wafer stacking  
Keyword(5) CoW  
Keyword(6) WoW  
Keyword(7) D2W  
Keyword(8)  
1st Author's Name Yoshihisa Kagawa  
1st Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
2nd Author's Name Yukako Ikegami  
2nd Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
3rd Author's Name Takahiro Kamei  
3rd Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
4th Author's Name Hayato Iwamoto  
4th Author's Affiliation Sony Semiconductor Solutions Corporation (SSS)
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Speaker Author-1 
Date Time 2024-02-21 15:50:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2023-87 
Volume (vol) vol.123 
Number (no) no.385 
Page pp.31-35 
#Pages 5 
Date of Issue 2024-02-14 (SDM) 

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